| Manufacturer | Package/Case | Capacitance | Tolerance | Voltage Rating - AC | Voltage Rating - DC | Dielectric Material | ESR (Equivalent Series Resistance) | Operating Temperature | Mounting Type | Size / Dimension | Height - Seated (Max) | Termination | Lead Spacing | Applications | Ratings | Features |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Package/Case | Capacitance | Tolerance | Voltage Rating - AC | Voltage Rating - DC | Dielectric Material | ESR (Equivalent Series Resistance) | Operating Temperature | Mounting Type | Size / Dimension | Height - Seated (Max) | Termination | Lead Spacing | Applications | Ratings | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
B32614A6105K8CAPACITOR |
5,674 | - |
|
- |
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
B32613A3105K8CAPACITOR |
3,257 | - |
|
- |
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
B32614S9684K500CAPACITOR |
5,263 | - |
|
- |
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
B32613A6474K8CAPACITOR |
6,543 | - |
|
- |
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CB027D0153JBAFILM CHIP |
6,928 | - |
|
Datasheet |
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CB042K0153JBCFILM CHIP |
5,013 | - |
|
Datasheet |
2220 (5750 Metric) | 0.015 µF | ±5% | 250V | 630V | Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked | - | -55°C ~ 125°C | Surface Mount | 0.228" L x 0.197" W (5.80mm x 5.00mm) | 0.157" (4.00mm) | Solder Pads | - | General Purpose | - | Low ESR, Low ESL |
|
CB018B0103K--FILM CHIP |
2,282 | - |
|
Datasheet |
1206 (3216 Metric) | 10000 pF | ±10% | 10V | 16V | Polyphenylene Sulfide (PPS), Metallized - Stacked | - | -55°C ~ 125°C | Surface Mount | 0.130" L x 0.063" W (3.30mm x 1.60mm) | 0.045" (1.15mm) | - | - | General Purpose | - | Low ESR, Low ESL |
|
CB182G0105J--FILM CHIP |
2,368 | - |
|
Datasheet |
6054 (153137 Metric) | 1 µF | ±5% | 160V | 250V | Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked | - | -55°C ~ 125°C | Surface Mount | 0.602" L x 0.539" W (15.30mm x 13.70mm) | 0.236" (6.00mm) | Solder Pads | - | General Purpose | - | Low ESR, Low ESL |
|
CB052K0223JBCFILM CHIP |
2,997 | - |
|
Datasheet |
2824 (7260 Metric) | 0.022 µF | ±5% | 250V | 630V | Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked | - | -55°C ~ 125°C | Surface Mount | 0.283" L x 0.240" W (7.20mm x 6.10mm) | 0.138" (3.50mm) | Solder Pads | - | General Purpose | - | Low ESR, Low ESL |
|
FMP6M0473K022ADVANCED DC LINK |
5,882 | - |
|
Datasheet |
Radial | 0.047 µF | ±10% | - | 1600V (1.6kV) | Polypropylene (PP), Metallized | - | -40°C ~ 105°C | Through Hole | 1.024" L x 0.335" W (26.00mm x 8.50mm) | 0.689" (17.50mm) | PC Pins | 0.886" (22.50mm) | DC Link, DC Filtering; High Pulse, DV/DT | - | - |
|
FVE36H0225K22ADVANCED DC LINK |
2,418 | - |
|
Datasheet |
Radial | 2.2 µF | ±10% | 305V | - | Polypropylene (PP), Metallized | - | -40°C ~ 110°C | Through Hole | 1.220" L x 0.551" W (31.00mm x 14.00mm) | 1.122" (28.50mm) | PC Pins | 1.083" (27.50mm) | EMI, RFI Suppression | - | - |
|
FVD16H0474M22ADVANCED DC LINK |
8,446 | - |
|
Datasheet |
Radial | 0.47 µF | ±20% | 305V | - | Polypropylene (PP), Metallized | - | -40°C ~ 110°C | Through Hole | 1.024" L x 0.335" W (26.00mm x 8.50mm) | 0.689" (17.50mm) | PC Pins | 0.886" (22.50mm) | EMI, RFI Suppression | - | - |
|
CB047I0333KBCFILM CHIP |
8,978 | - |
|
Datasheet |
2220 (5750 Metric) | 0.033 µF | ±10% | 200V | 400V | Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked | - | -55°C ~ 125°C | Surface Mount | 0.228" L x 0.197" W (5.80mm x 5.00mm) | 0.154" (3.90mm) | Solder Pads | - | General Purpose | - | Low ESR, Low ESL |
|
FMF6N0103J02LADVANCED DC LINK |
9,549 | - |
|
Datasheet |
Radial | 10000 pF | ±5% | - | 2000V (2kV) | Polypropylene (PP), Metallized | - | -40°C ~ 105°C | Through Hole | 0.709" L x 0.295" W (18.00mm x 7.50mm) | 0.551" (14.00mm) | PC Pins | 0.591" (15.00mm) | DC Link, DC Filtering | - | - |
|
CB172K0104K--FILM CHIP |
2,814 | - |
|
Datasheet |
5040 (127102 Metric) | 0.1 µF | ±10% | 250V | 630V | Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked | - | -55°C ~ 125°C | Surface Mount | 0.504" L x 0.402" W (12.80mm x 10.20mm) | 0.197" (5.00mm) | Solder Pads | - | General Purpose | - | Low ESR, Low ESL |
|
FLCC6L0355K2CADVANCED DC LINK |
7,422 | - |
|
- |
Radial | 3.5 µF | ±10% | 400V | - | Polypropylene (PP), Metallized | 7 mOhms | -40°C ~ 85°C | Through Hole | 1.260" L x 0.709" W (32.00mm x 18.00mm) | 1.319" (33.50mm) | PC Pins | 1.083" (27.50mm) | EMI, RFI Suppression | - | - |
|
CB028B0823J--FILM CHIP |
2,670 | - |
|
Datasheet |
1210 (3225 Metric) | 0.082 µF | ±5% | 10V | 16V | Polyphenylene Sulfide (PPS), Metallized - Stacked | - | -55°C ~ 125°C | Surface Mount | 0.130" L x 0.098" W (3.30mm x 2.50mm) | 0.071" (1.80mm) | Solder Pads | - | General Purpose | - | Low ESR, Low ESL |
|
CB038B0154GBAFILM CHIP |
5,084 | - |
|
Datasheet |
1812 (4532 Metric) | 0.15 µF | ±2% | 10V | 16V | Polyphenylene Sulfide (PPS), Metallized - Stacked | - | -55°C ~ 125°C | Surface Mount | 0.177" L x 0.126" W (4.50mm x 3.20mm) | 0.091" (2.30mm) | Solder Pads | - | General Purpose | - | Low ESR, Low ESL |
|
CB187D0475J--FILM CHIP |
7,410 | - |
|
Datasheet |
6054 (153137 Metric) | 4.7 µF | ±5% | 40V | 63V | Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked | - | -55°C ~ 125°C | Surface Mount | 0.602" L x 0.539" W (15.30mm x 13.70mm) | 0.283" (7.20mm) | Solder Pads | - | General Purpose | - | Low ESR, Low ESL |
|
FMH6M0223K02LADVANCED DC LINK |
3,798 | - |
|
Datasheet |
Radial | 0.022 µF | ±10% | - | 1600V (1.6kV) | Polypropylene (PP), Metallized | - | -40°C ~ 105°C | Through Hole | 0.709" L x 0.335" W (18.00mm x 8.50mm) | 0.591" (15.00mm) | PC Pins | 0.591" (15.00mm) | DC Link, DC Filtering | - | - |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Film Capacitors components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.