Sensor and Detector Interfaces

Manufacturer	Package/Case	Series	Packaging	Product Status	Programmable	Type	Input Type	Output Type	Current - Supply	Operating Temperature	Grade	Qualification	Mounting Type	Supplier Device Package
ABLIC Inc. Allegro MicroSystems ams-OSRAM USA INC. Analog Devices Inc. Analog Devices Inc./Maxim Integrated Asahi Kasei Microdevices/AKM Atmel Azoteq (Pty) Ltd Broadcom Limited Burr Brown Cirrus Logic Inc. Diodes Incorporated EM Microelectronic Fairchild Semiconductor Freescale Semiconductor - NXP Grayhill Inc. Harris Corporation Infineon Technologies Interlink Electronics Intersil LSI/CSI Lumissil Microsystems MaxLinear, Inc. Melexis Technologies NV Microchip Technology Motorola National Semiconductor NXP Semiconductors onsemi Renesas Renesas Electronics Operations Services Limited ROHM Semiconductor ScioSense Semtech Corporation STMicroelectronics Texas Instruments Triad Magnetics	- 10-PowerTFSOP, 10-MSOP (0.118", 3.00mm Width) 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) 10-VFDFN Exposed Pad 10-WFDFN Exposed Pad 100-LFBGA, CSPBGA 100-TQFP 105-LFBGA, CSPBGA 112-LFBGA, CSPBGA 12-LFLGA 12-WFBGA, WLBGA 12-WFDFN Exposed Pad 12-WFQFN Exposed Pad 12-XFBGA, DSBGA 120-TFBGA 128-LFBGA, CSPBGA 14-CDIP (0.300", 7.62mm) 14-DIP (0.300", 7.62mm) 14-LSSOP (0.173", 4.40mm Width) 14-SOIC (0.154", 3.90mm Width) 14-SOIC (0.295", 7.50mm Width) 14-SSOP (0.209", 5.30mm Width) 14-TSSOP (0.173", 4.40mm Width) 14-VFQFN Exposed Pad 16-CDIP (0.300", 7.62mm) 16-DIP (0.300", 7.62mm) 16-LSOP (0.173", 4.40mm Width) 16-LSSOP (0.173", 4.40mm Width) 16-SOIC (0.154", 3.90mm Width) 16-SOIC (0.154", 3.90mm Width), 14 Leads 16-SOIC (0.173", 4.40mm Width) 16-SOIC (0.295", 7.50mm Width) 16-SSOP (0.154", 3.90mm Width) 16-SSOP (0.209", 5.30mm Width) 16-TSSOP (0.173", 4.40mm Width) 16-TSSOP (0.173", 4.40mm Width) Exposed Pad 16-UFBGA, WLCSP 16-UFQFN Exposed Pad 16-VFQFN 16-VFQFN Exposed Pad 16-VQFN Exposed Pad 16-VQFN Exposed Pad, CSP 16-WFBGA, WLBGA 16-WFQFN Exposed Pad 16-WQFN Exposed Pad 16-XFQFN Exposed Pad 17-UFBGA, WLCSP 18-DIP (0.300", 7.62mm) 18-SOIC (0.295", 7.50mm Width) 18-UFBGA, WLCSP 196-LFBGA, CSPBGA 20-CDIP (0.300", 7.62mm) 20-CLCC 20-LCC (J-Lead) 20-PowerTSSOP (0.173", 4.40mm Width) 20-SOIC (0.295", 7.50mm Width) 20-SOIC (0.295", 7.50mm Width) Exposed Pad 20-SSOP (0.209", 5.30mm Width) 20-TSSOP (0.173", 4.40mm Width) 20-UFQFN Exposed Pad 20-VFQFN Exposed Pad 20-VQFN Exposed Pad 20-WFQFN Exposed Pad 20-WFQFN Exposed Pad, CSP 24-CDIP (0.600", 15.24mm) 24-SOIC (0.295", 7.50mm Width) 24-SSOP (0.154", 3.90mm Width) 24-SSOP (0.209", 5.30mm Width) 24-UFBGA, WLCSP 24-VFQFN Exposed Pad 24-WFBGA, WLBGA 24-WFQFN Exposed Pad 25-TFBGA 28-DIP (0.500", 12.70mm), 22 Leads 28-LCC (J-Lead) 28-LSSOP (0.220", 5.60mm Width) 28-SOIC (0.295", 7.50mm Width) 28-SSOP (0.209", 5.30mm Width) 28-TSSOP (0.173", 4.40mm Width) 28-TSSOP (0.173", 4.40mm Width) Exposed Pad 28-UFQFN Exposed Pad 28-VFQFN Exposed Pad 28-VQFN Exposed Pad 28-WFQFN Exposed Pad 28-WFQFN Exposed Pad, CSP 32-SOP (0.213", 5.40mm Width) 32-TQFP Exposed Pad 32-VFQFN Exposed Pad 32-VFQFN Exposed Pad, 32-MLF® 32-WFQFN Exposed Pad 32-WFQFN Exposed Pad, CSP 33-UFBGA, WLCSP 35-UFBGA, WLCSP 36-UFBGA, DSBGA 36-VFQFN Exposed Pad 36-WFBGA, WLBGA 38-DIP (0.500", 12.70mm), 8 Leads 38-DIP (0.800", 20.32mm), 12 Leads 38-DIP (0.800", 20.32mm), 15 Leads 38-PowerTFSOP (0.173", 4.40mm Width) 38-TFSOP (0.173", 4.40mm Width) Exposed Pad 38-VFLGA Module 40-VFQFN Exposed Pad 40-VFQFN Exposed Pad, CSP 40-WFQFN Exposed Pad 44-BSSOP (0.433", 11.00mm Width) Exposed Pad 44-LCC (J-Lead) 44-LQFP 44-VFQFN Exposed Pad 48-LQFP 48-PowerTQFP 48-TQFP 48-TQFP Exposed Pad 48-VFQFN Exposed Pad 48-VFQFN Exposed Pad, CSP 48-WFQFN Exposed Pad, CSP 49-VFBGA 54-BSSOP (0.295", 7.50mm Width) Exposed Pad 54-SSOP (0.295", 7.50mm Width) Exposed Pad 56-VFQFN Exposed Pad, CSP 56-WFQFN Exposed Pad 6-WDFN Exposed Pad 64-LFBGA, CSPBGA 64-LQFP 64-PowerTQFP 64-QFP 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad, CSP 68-VFQFN Exposed Pad 70-LFBGA 8-CDIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm) 8-FlipChip 8-SOIC (0.154", 3.90mm Width) 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) 8-UFDFN Exposed Pad 8-VDFN Exposed Pad 8-VFDFN Exposed Pad 84-LFBGA, CSPBGA 84-VFQFN Dual Rows, Exposed Pad 9-UFBGA, WLCSP 9-WFBGA, WLBGA 9-XFBGA, WLCSP 96-LFBGA, CSPBGA Die Module SC-74A, SOT-753 TO-205AA, TO-5-8 Metal Can	* - 65 AD9840 AD9995 cLite™ IQ Switch® ProxFusion® IQ Switch®, ProxFusion™ IQ Switch®, ProxSense® LT® MicroJoystick PICOSTRAIN® QTwo™ TPS ZoomingADC™	- Bag Box Bulk Cut Tape (CT) Strip Tape & Reel (TR) Tray Tube	Active Discontinued at Digi-Key Last Time Buy Not For New Designs Obsolete	- Not Verified Verified	- ADC, DAC Automotive Battery Management Biometric Sensor Hub Capacitance-to-Digital Converter Capacitive Sensor Capacitive Sensor Controller Capacitive Switch Capacitive Switch Controller Capacitive Touch and Proximity Sensor Capacitive Touch Screen Controller CCD Signal Processor, 10-Bit CCD Signal Processor, 12-Bit CCD Signal Processor, 14-Bit Clock Generator Controller Converter Current Loop Protector Current Transmitter Data Acquisition Data Acquisition System (DAS) Detector Controller Distance Measuring, Preamplifier Distributed Systems Interface Engine Knock Signal Processor Front End Hall Effect Sensor Hall Effect Switch Horn Driver Image Sensor Infrared (IR) Interface Level Shifter Light to Digital Converter Motion Coprocessor Optical Output Driver Piezoelectric - Strain Gauge Power Management Preamplifier Pressure Sensor Programmable Amplifier/Attenuator Proximity Detector R/D Converter Relay/Load Driver Resistive Sensor Conditioner Sensor Interface Sensor Interface - Unprogrammed Sensor Interface, Signal Conditioner Serializer SFP Laser Controller SFP+ Controller Signal Conditioner Signal Processor Smart Sensor Smoke Detector Temperature Sensor Thermocouple Amplifier Thermocouple Conditioner Thermocouple to Digital Converter Time to Flight to Digital Converter Touch Sensor Translator USB Joystick Controller Variable Reluctance	- Analog Analog Current Analog Voltage Analog, Digital Analog, Logic, Photodiode Capacitive Capacitive, Inductive CML CMOS CMOS, LVDS Differential Digital Ionization Logic LVDS Parallel Photodiode Photoelectric Serial Thermocouple Thermocouple (J) Thermocouple (K) Thermocouple (Multiple) Ultrasound Voltage	- 1-Wire® 1-Wire®, I2C 1-Wire®, I2C, SPI 2-Wire 3-Wire Serial 3-Wire SPI Serial 4 ~ 20mA 4mA ~ 20mA Analog Analog Voltage Analog, CMOS, Digital Analog, Digital CML CMOS Current Differential Digital Digital, I2C Digital, Serial I2C I2C, 2-Wire Serial I2C, Serial I2C, Serial, SPI I2C, SPI ISO9141 LIN Logic LVDS LVDS, Serial, SPI Parallel Serial Serial, SPI SPI Thermocouple Voltage	- 1 mA 1 µA 1.1 mA 1.2 mA 1.3 mA 1.35 mA 1.4 mA 1.5 mA 1.5 µA 1.6 mA 1.9 µA 10 mA 10 nA 10 µA 100 nA 100 µA 12 mA 12 µA 12.5 mA 120 µA 125 mA 13 mA 13.5 mA 13.6 mA 13.6 µA 133 mA 14 µA 145 mA 15 mA 150 nA 150 µA 160 µA 165 mA 170 µA 173 µA 18 mA 180 µA 184 µA 2 mA 2 µA 2.1 mA 2.3 mA 2.5 mA 2.5 µA 2.57 mA 2.6 mA 2.7 mA 2.8 mA 2.85 mA 2.9 mA 2.95 mA 20 mA 200 µA 225 µA 23 mA 24 mA 25 mA 250 mA 250 µA 27 mA 29 µA 3 mA 3.5 mA 3.5 µA 3.6 µA 3.8 µA 30 mA 30 µA 300 µA 350 µA 360 µA 4 mA 4 µA 4.2 µA 4.5 mA 4.9 mA 40 mA 40 µA 41 mA 457 µA 476 µA 48 mA 495 mA 5 mA 5.3 µA 5.5 mA 50 µA 500 µA 55 mA 550 µA 6 mA 6 µA 6.5 mA 6.8 mA 600 µA 62 µA 7 mA 7.5 mA 70 µA 720 µA 73 mA 75 mA 8 mA 8 µA 8.5 mA 80 mA 80 µA 800 µA 840 µA 86 mA 890 µA 9 mA 9 µA 9.3 mA 90 µA 900 µA 95 mA 950 µA	- -10°C ~ 60°C -10°C ~ 60°C (TA) -20°C ~ 105°C (TA) -20°C ~ 45°C -20°C ~ 70°C -20°C ~ 75°C -20°C ~ 85°C -25°C ~ 105°C (TA) -25°C ~ 70°C (TA) -25°C ~ 75°C -25°C ~ 85°C -30°C ~ 75°C -40°C ~ 100°C -40°C ~ 105°C -40°C ~ 105°C (TA) -40°C ~ 110°C -40°C ~ 115°C -40°C ~ 120°C -40°C ~ 125°C -40°C ~ 125°C (TA) -40°C ~ 125°C (TJ) -40°C ~ 140°C -40°C ~ 150°C -40°C ~ 150°C (TA) -40°C ~ 70°C (TA) -40°C ~ 85°C -40°C ~ 85°C (TA) -40°C ~ 90°C (TA) -40°C ~ 95°C -45°C ~ 125°C -55°C ~ 125°C -55°C ~ 125°C (TA) -55°C ~ 150°C 0°C ~ 50°C 0°C ~ 60°C (TA) 0°C ~ 70°C 0°C ~ 70°C (TA) 0°C ~ 85°C 0°C ~ 85°C (TA) 0°C ~ 90°C 150°C 20°C ~ 85°C 25°C ~ 100°C	- Automotive	- AEC-Q100	- Panel Mount Surface Mount Surface Mount, Wettable Flank Through Hole	- 0402/SOD-923F 10-HVSSOP 10-MSOP 10-TDFN (3x3) 10-TDFN (3x4) 10-uMAX 10-uMAX/uSOP 10-VSON (3x3) 10-VSON (3x4) 10-VSSOP 100-CSPBGA (9x9) 100-TQFP (14x14) 105-CSPBGA (8x8) 112-CSPBGA (8x8) 12-DIP 12-DSBGA (2.45x1.7) 12-LGA-CAV (2.8x5) 12-MLPD-WEP (4x4) 12-PDIP 12-TDFN (3x3) 12-TQFN (3x3) 12-WLP (2.14x1.56) 12-WSON (4x4) 120-TFBGA (9x9) 128-CSPBGA (9x9) 14-CDIP 14-PDIP 14-QFN (4x4) 14-SO 14-SOIC 14-SSOP 14-SSOP-B 14-TSSOP 16-CDIP 16-CERDIP 16-DIP 16-LFCSP-VQ (4x4) 16-MLPQ (4x4) 16-MLPQ-EP (4x4) 16-PDIP 16-QFN (3x3) 16-QFN (4x4) 16-QSOP 16-SOIC 16-SOP 16-SSOP 16-SSOP-A 16-SSOP-B 16-TSSOP 16-TSSOP-EP 16-UQFN (3x3) 16-VQFN (4x4) 16-WLCSP (1.62x1.62) 16-WLCSP (1.66x1.66) 16-WLCSP (2.46x1.4) 16-WLP (1.55x1.57) 16-WLP (2.45x2.45) 16-WQFN (4x4) 17-WLCSP (2.46x1.4) 18-PDIP 18-SOIC 18-WLCSP (1.62x1.62) 196-CSPBGA (12x12) 20-CDIP 20-CLCC (9x9) 20-HSOIC 20-HTSSOP 20-LFCSP (4x4) 20-MQFN (5x5) 20-PLCC (9x9) 20-QFN (3x3) 20-QFN (4x4) 20-SOIC 20-SSOP 20-TQFN (4x4) 20-TSSOP 20-VQFN (5x5) 24-CDIP 24-QFN (3.5x3.5) 24-QFN (4x4) 24-QFN (4x5) 24-SO 24-SOIC 24-SSOP 24-TQFN (3.5x3.5) 24-TQFN (3x3) 24-TQFN (4x4) 24-VFQFPN (4x4) 24-WLCSP (2.62x1.8) 24-WLP (2.5x1.75) 25-NFBGA (4x4) 28-DIP 28-LFCSP-WQ (4x4) 28-PLCC (11.51x11.51) 28-QFN (6x6) 28-SOIC 28-SSOP 28-SSOP-B 28-TQFN (5x5) 28-TSSOP 28-TSSOP-EP 28-UQFN (4x4) 32-LFCSP-WQ (5x5) 32-MLF® (5x5) 32-QFN 32-QFN (5x5) 32-SSOP-A 32-STQFN (4x4) 32-TQFN (5x5) 32-TQFP (5x5) 33-WLCSP (3.11x2.14) 35-WLCSP (3.11x2.14) 36-DSBGA (3.66x3.66) 36-VQFN (6x6) 36-WLP (2.57x2.57) 38-HTSSOP 38-OLGA (4.1x4.5) 38-TSSOP-EP 40-LFCSP (6x6) 40-LFCSP-VQ (6x6) 40-QFN (5x5) 40-QFN (6x6) 40-TQFN (5x5) 40-VFQFPN (5x5) 44-HSOP 44-MLPQ (7x7) 44-PLCC (16.59x16.59) 44-TQFP (10x10) 48-HTQFP (7x7) 48-LFCSP (7x7) 48-LFCSP-VQ (7x7) 48-LFQFP (7x7) 48-LQFP (7x7) 48-QFN (7x7) 48-QFP (7x7) 48-TQFP (7x7) 48-TQFP-EP (7x7) 49-VFBGA (5x5) 54-SOIC 54-SOIC-EP 56-LFCSP (8x8) 56-LFCSP-VQ (8x8) 56-QFN (7x7) 6-MLPD-W (3x3) 6-TDFN (3x3) 64-CSPBGA (9x9) 64-HTQFP (10x10) 64-LFCSP-VQ (9x9) 64-PQFP (14x14) 64-QFN (9x9) 64-QFP (10x10) 68-QFN (10x10) 70-GQFN (6x10) 8-CERDIP 8-DFN (2x3) 8-DFN (3x3) 8-DIP 8-FlipChip 8-MSOP 8-PDIP 8-QFN (2x2) 8-SO 8-SOIC 8-SON (3x3) 8-uMAX/uSOP 8-VSSOP 8-µMAX 84-AQFN (7x7) 84-CSPBGA (12x6) 84-CSPBGA (6x6) 9-WLCSP (1.53x1.07) 9-WLCSP (1.66x1.66) 9-WLP (1.53x1.53) 96-CSPBGA (8x8) Die Micro8™ Module PG-DSO-14-66 PG-DSO-16 PG-DSO-16-1 PG-LQFP-64 SOT-23-5 TO-5 VQFN020V4040 VQFN028V5050 VQFN16Z3030A Wafer

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Package/Case	Series	Packaging	Product Status	Programmable	Type	Input Type	Output Type	Current - Supply	Operating Temperature	Grade	Qualification	Mounting Type	Supplier Device Package
ZSSC3123AA6C DICE (WAFER SAWN) - FRAME Renesas Electronics Corporation	4,282	-	RFQ	Datasheet	Die	cLite™	Tray	Active	-	Capacitive Sensor	Capacitive	I2C, SPI	1.1 mA	-40°C ~ 125°C (TA)	-	-	Surface Mount	Die
XTR116UA/2K5G4 IC CURRENT TRANSMITTER 8SOIC Texas Instruments	4,612	-	RFQ	Datasheet	8-SOIC (0.154", 3.90mm Width)	-	Tape & Reel (TR)	Discontinued at Digi-Key	Not Verified	Current Transmitter	Voltage	Voltage	20 mA	-40°C ~ 85°C	-	-	Surface Mount	8-SOIC
ZSSC3018BA1C DICE (WAFER SAWN) - FRAME Renesas Electronics Corporation	1,217	-	RFQ	Datasheet	Die	-	Tray	Active	-	Signal Conditioner	Differential	I2C, Serial, SPI	1.5 mA	-40°C ~ 125°C (TA)	-	-	Surface Mount	Die
MTCH650-I/SS IC CONVERTER LVL SHIFTER 28SSOP Microchip Technology	3,246	-	RFQ	Datasheet	28-SSOP (0.209", 5.30mm Width)	-	Tube	Active	Not Verified	Level Shifter	-	-	200 µA	-40°C ~ 85°C	-	-	Surface Mount	28-SSOP
ZSSC3215CI5B WAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation	3,581	-	RFQ	-	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-
ZSSC3215CI1B WAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation	3,167	-	RFQ	-	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-
ZSSC3215CI1C DICE (WAFER SAWN) - FRAME Renesas Electronics Corporation	4,094	-	RFQ	-	-	-	Tray	Active	-	-	-	-	-	-	-	-	-	-
ZSSC4151CE4R PQFN / 24 / 4X4MM S1 - TAPE&REE Renesas Electronics Corporation	1,968	-	RFQ	Datasheet	24-VFQFN Exposed Pad	-	Tape & Reel (TR)	Active	-	Signal Conditioner	-	1-Wire®, I2C	7 mA	-40°C ~ 150°C	Automotive	AEC-Q100	Surface Mount	24-QFN (4x4)
ZSSC4161DE1C-APB TESTED DIE, SAWN ON FOIL -CFG 41 Renesas Electronics Corporation	4,560	-	RFQ	-	-	-	Tape & Reel (TR)	Active	-	-	-	-	-	-	-	-	-	-
ZSSC3018BA1B WAFER (UNSAWN) - BOX Renesas Electronics Corporation	3,897	-	RFQ	Datasheet	Die	-	Tray	Active	-	Signal Conditioner	Differential	I2C, Serial, SPI	1.5 mA	-40°C ~ 125°C (TA)	-	-	Surface Mount	Die
ZSSC4169DE5R-APC TSSOP / 16 / 5X4MM-0 Renesas Electronics Corporation	4,805	-	RFQ	Datasheet	24-VFQFN Exposed Pad	-	Tape & Reel (TR)	Active	-	Signal Conditioner	Differential	1-Wire®	-	-40°C ~ 150°C	Automotive	AEC-Q100	Surface Mount, Wettable Flank	24-QFN (4x4)
U6268B-MFPG3 IC DUAL SENSOR 16SOIC Microchip Technology	3,332	-	RFQ	Datasheet	16-SOIC (0.154", 3.90mm Width)	-	Tape & Reel (TR)	Obsolete	Not Verified	Interface	-	-	-	-40°C ~ 95°C	-	-	Surface Mount	16-SOIC
LM1815MX IC AMP ADAPTIV VAR SENSOR 14SOIC Texas Instruments	1,248	-	RFQ	Datasheet	14-SOIC (0.154", 3.90mm Width)	-	Tape & Reel (TR)	Obsolete	Not Verified	Sensor Interface	Logic	Logic	6 mA	-40°C ~ 125°C	-	-	Surface Mount	14-SOIC
ZSSC4151CE6R TSSOP / 16 / 4,4MM G1 - TAPE&REE Renesas Electronics Corporation	3,243	-	RFQ	Datasheet	16-TSSOP (0.173", 4.40mm Width)	-	Tape & Reel (TR)	Active	-	Signal Conditioner	Analog	1-Wire®, I2C	7 mA	-40°C ~ 150°C (TA)	Automotive	AEC-Q100	Surface Mount	16-TSSOP
MTCH650-I/MV IC CONVERTER LVL SHIFTER 20UQFN Microchip Technology	3,473	-	RFQ	Datasheet	28-UFQFN Exposed Pad	-	Tube	Active	Not Verified	Level Shifter	-	-	200 µA	-40°C ~ 85°C	-	-	Surface Mount	28-UQFN (4x4)
MTCH650T-I/SS IC CONVERTER LVL SHIFTER 28SSOP Microchip Technology	2,637	-	RFQ	Datasheet	28-SSOP (0.209", 5.30mm Width)	-	Tape & Reel (TR)	Active	Not Verified	Level Shifter	-	-	200 µA	-40°C ~ 85°C	-	-	Surface Mount	28-SSOP
ZSSC4161DE4R PQFN / 24 / 4X4MM S1 - TAPE&REE Renesas Electronics Corporation	1,767	-	RFQ	Datasheet	24-VFQFN Exposed Pad	-	Tape & Reel (TR)	Active	-	Signal Conditioner	Differential	1-Wire®, I2C	-	-40°C ~ 150°C	-	-	Surface Mount	24-QFN (4x4)
MC33793DR2 IC DSI SLAVE FOR R-SENSE 16-SOIC NXP USA Inc.	3,925	-	RFQ	Datasheet	16-SOIC (0.154", 3.90mm Width)	-	Tape & Reel (TR)	Obsolete	Not Verified	Distributed Systems Interface	Logic	Logic	-	-40°C ~ 150°C	-	-	Surface Mount	16-SOIC
ZSSC3240CC6B IC SENSOR SIGNAL CONDITIONER Renesas Electronics Corporation	1,325	-	RFQ	Datasheet	Die	-	Bulk	Active	Not Verified	Resistive	Analog	1-Wire®, I2C, SPI	2.8 mA	-40°C ~ 85°C (TA)	-	-	Surface Mount	Die
ZSSC3240CC2B IC SENSOR SIGNAL CONDITIONER Renesas Electronics Corporation	1,850	-	RFQ	Datasheet	Die	-	Bulk	Active	Not Verified	Resistive	Analog	1-Wire®, I2C, SPI	2.8 mA	-40°C ~ 85°C (TA)	-	-	Surface Mount	Die

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Sensor and Detector Interfaces Electronic Components Sourcing and Lifecycle Support

FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Sensor and Detector Interfaces components, we support both current production requirements and long-term component availability across demanding product lifecycles.

Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.

How FPGAX Supports Sensor and Detector Interfaces Requirements

Active component sourcing: support for current FPGA, programmable logic, and related semiconductor requirements.
End-of-life sourcing: assistance with obsolete and hard-to-find parts when designs must remain in production.
Lifecycle management: sourcing support during product transitions, allocation periods, and supply interruptions.
Design continuity: long-term supply support intended to reduce redesign pressure and production disruption.
Major programmable logic brands: sourcing coverage includes Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic.

Supply Support at a Glance

Requirement	FPGAX Support
Current production	Active FPGA, programmable logic, and semiconductor component sourcing
Legacy programs	End-of-life and hard-to-find component sourcing
Supply continuity	Lifecycle transition and long-term availability support
Quality requirements	Traceable sourcing and quality-management processes

Focused on FPGA and Programmable Logic Supply

FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.

Sensor and Detector Interfaces FAQ

Can FPGAX source both active and end-of-life Sensor and Detector Interfaces components?

Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.

Which programmable logic manufacturers does FPGAX support?

Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.

How does FPGAX help with component lifecycle changes?

We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.

What quality and traceability standards does FPGAX follow?

FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.

What information should I provide for a Sensor and Detector Interfaces sourcing request?

Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.