| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MT53E3G32D6CY-046 WT:C TRIC DRAM 96GBIT TFBGA |
3,153 |
|
- |
- | - | Tape & Reel (TR) | Active | - | - | DRAM | SDRAM - Mobile LPDDR4 | 96Gbit | - | - | - | - | - | - | - | - | - | - | - |
|
MT53E3G32D6CY-046 WT:CIC DRAM 96GBIT TFBGA |
4,345 |
|
- |
- | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR4 | 96Gbit | - | - | - | - | - | - | - | - | - | - | - |
|
MT62F1G64D4ZX-026 WT:CIC DRAM 64GBIT LVSTL 496UFBGA |
3,266 |
|
- |
- | 496-UFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 1G x 64 | LVSTL | 3.75 GHz | - | - | 1.01V ~ 1.12V | -25°C ~ 85°C (TC) | - | - | Surface Mount | 496-UFBGA (14x12.4) |
|
MT62F1G64D4AH-023 WT:BIC DRAM 64GBIT PAR FBGA |
2,295 |
|
- |
- | - | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 1G x 64 | Parallel | 4.266 GHz | - | - | 1.01V ~ 1.12V | -25°C ~ 85°C | - | - | - | - |
|
AT28C010E-15TUIC EEPROM 1MBIT PARALLEL 32TSOP |
4,677 |
|
Datasheet |
- | 32-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | EEPROM | EEPROM | 1Mbit | 128K x 8 | Parallel | - | 10ms | 150 ns | 4.5V ~ 5.5V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 32-TSOP |
|
CY7C12481KV18-400BZXCIC SRAM 36MBIT PARALLEL 165FBGA |
3,500 |
|
Datasheet |
- | 165-LBGA | Tray | Obsolete | Not Verified | Volatile | SRAM | SRAM - Synchronous, DDR II+ | 36Mbit | 2M x 18 | Parallel | 400 MHz | - | - | 1.7V ~ 1.9V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 165-FBGA (13x15) |
|
M3016316035NX0PBCRIC RAM 16MBIT PAR 484CABGA |
2,472 |
|
Datasheet |
- | 484-BGA | Tape & Reel (TR) | Obsolete | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 16Mbit | 1M x 16 | Parallel | - | 35ns | 35 ns | 2.7V ~ 3.6V | -40°C ~ 105°C | - | - | Surface Mount | 484-CABGA (23x23) |
|
M3016316035NX0PTBRIC RAM 16MBIT PAR 54TSOP |
4,859 |
|
Datasheet |
- | 54-TSOP (0.400", 10.16mm Width) | Tape & Reel (TR) | Obsolete | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 16Mbit | 1M x 16 | Parallel | - | 35ns | 35 ns | 2.7V ~ 3.6V | -40°C ~ 105°C | - | - | Surface Mount | 54-TSOP |
|
MT62F1G64D8CH-036 WT:A TRIC DRAM 64GBIT 2.75GHZ FBGA |
3,879 |
|
- |
- | - | Tape & Reel (TR) | Obsolete | Not Verified | Non-Volatile | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 1G x 64 | - | 2.75 GHz | - | - | 1.05V | -25°C ~ 85°C | - | - | - | - |
|
CY14B116L-Z45XITIC NVSRAM 16MBIT PAR 48TSOP I |
3,820 |
|
Datasheet |
- | 48-TFSOP (0.724", 18.40mm Width) | Tape & Reel (TR) | Obsolete | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 16Mbit | 2M x 8 | Parallel | - | 45ns | 45 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
CY14B116N-Z30XITIC NVSRAM 16MBIT PAR 48TSOP I |
2,463 |
|
Datasheet |
- | 48-TFSOP (0.724", 18.40mm Width) | Tape & Reel (TR) | Last Time Buy | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 16Mbit | 1M x 16 | Parallel | - | 30ns | 30 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
CY14B116N-Z45XITIC NVSRAM 16MBIT PAR 48TSOP I |
3,854 |
|
Datasheet |
- | 48-TFSOP (0.724", 18.40mm Width) | Tape & Reel (TR) | Last Time Buy | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 16Mbit | 1M x 16 | Parallel | - | 45ns | 45 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
M3016316045NX0PTBYIC RAM 16MBIT PAR 54TSOP |
2,881 |
|
Datasheet |
- | 54-TSOP (0.400", 10.16mm Width) | Tray | Obsolete | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 16Mbit | 1M x 16 | Parallel | - | 45ns | 45 ns | 2.7V ~ 3.6V | -40°C ~ 105°C | - | - | Surface Mount | 54-TSOP |
|
M3016316045NX0PBCYIC RAM 16MBIT PAR 484CABGA |
1,846 |
|
Datasheet |
- | 484-BGA | Tray | Obsolete | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 16Mbit | 1M x 16 | Parallel | - | 45ns | 45 ns | 2.7V ~ 3.6V | -40°C ~ 105°C | - | - | Surface Mount | 484-CABGA (23x23) |
|
MT62F1G64D4CZ-023 AIT:CIC DRAM 64GBIT VFBGA |
3,587 |
|
- |
- | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 1G x 64 | - | - | - | - | - | - | - | - | - | - |
|
MT62F1G64D4CZ-023 AIT:C TRIC DRAM 64GBIT VFBGA |
3,395 |
|
- |
- | - | Tape & Reel (TR) | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 1G x 64 | - | - | - | - | - | - | - | - | - | - |
|
MT53E2G32D4DE-046 AIT:C TRIC DRAM 64GBIT PAR 200TFBGA |
1,217 |
|
- |
- | 200-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | 2G x 32 | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 95°C (TC) | Automotive | AEC-Q100 | Surface Mount | 200-TFBGA (10x14.5) |
|
MT53E1G64D4HJ-046 AIT:CIC DRAM 64GBIT PAR 556WFBGA |
2,899 |
|
Datasheet |
- | 556-TFBGA | Box | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | 1G x 64 | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 95°C (TC) | Automotive | AEC-Q100 | Surface Mount | 556-WFBGA (12.4x12.4) |
|
MT53E1G64D4HJ-046 AIT:C TRIC DRAM 64GBIT PAR 556WFBGA |
1,846 |
|
Datasheet |
- | 556-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | 1G x 64 | Parallel | 2.133 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V | -40°C ~ 95°C (TC) | Automotive | AEC-Q100 | Surface Mount | 556-WFBGA (12.4x12.4) |
|
CY14B116N-Z30XIIC NVSRAM 16MBIT PAR 48TSOP I |
3,532 |
|
Datasheet |
- | 48-TFSOP (0.724", 18.40mm Width) | Tray | Last Time Buy | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 16Mbit | 1M x 16 | Parallel | - | 30ns | 30 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP I |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Memory components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.