| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MT62F2G32D4DS-026 AIT:B TRIC DRAM 64GBIT PAR 200WFBGA |
2,100 |
|
- |
- | 200-WFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 2G x 32 | Parallel | 3.2 GHz | - | - | 1.05V | -40°C ~ 95°C | Automotive | AEC-Q100 | Surface Mount | 200-WFBGA (10x14.5) |
|
MT62F1G64D4EK-023 AIT:B TRIC DRAM 64GBIT PAR 441TFBGA |
1,506 |
|
- |
- | 441-TFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 1G x 64 | Parallel | 2.133 GHz | - | - | 1.05V | -40°C ~ 95°C | Automotive | AEC-Q100 | Surface Mount | 441-TFBGA (14x14) |
|
MT62F2G32D4DS-023 AIT:BIC DRAM 64GBIT PAR 200WFBGA |
4,232 |
|
- |
- | 200-WFBGA | Box | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR5 | 64Gbit | 2G x 32 | Parallel | 4.266 GHz | - | - | 1.05V | - | Automotive | AEC-Q100 | Surface Mount | 200-WFBGA (10x14.5) |
|
MT53B512M64D4NW-062 WT:C TRIC DRAM 32GBIT 1.6GHZ FBGA |
3,641 |
|
- |
- | - | Tape & Reel (TR) | Obsolete | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 32Gbit | 512M x 64 | - | 1.6 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | - | - |
|
MT53B1024M32D4NQ-062 WT:C TRIC DRAM 32GBIT 1.6GHZ 200VFBGA |
4,509 |
|
- |
- | 200-VFBGA | Tape & Reel (TR) | Obsolete | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 32Gbit | 1G x 32 | - | 1.6 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | Surface Mount | 200-VFBGA (10x14.5) |
|
MT53D1024M32D4NQ-062 WT:D TRIC DRAM 32GBIT 1.6GHZ 200VFBGA |
2,623 |
|
- |
- | 200-VFBGA | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 32Gbit | 1G x 32 | - | 1.6 GHz | - | - | 1.1V | -30°C ~ 85°C (TC) | - | - | Surface Mount | 200-VFBGA (10x14.5) |
|
MT62F2G64D8AK-031 XT:BIC DRAM 128GBIT FBGA |
2,588 |
|
- |
- | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | - | - | - | - | - | - | - | - | - | - | - |
|
MT62F1G128D8AK-026 XT:CIC DRAM 128GBIT VFBGA |
4,071 |
|
- |
- | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | 1G x 128 | - | - | - | - | - | - | - | - | - | - |
|
MT62F2G64D8AS-026 XT:CIC DRAM 128GBIT VFBGA |
3,591 |
|
- |
- | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | - | - | - | - | - | - | - | - | - | - | - |
|
MT62F1G128DAVF-031 XT:BIC DRAM 128GBIT FBGA |
4,742 |
|
- |
- | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | 1G x 128 | - | - | - | - | - | - | - | - | - | - |
|
MT62F2G64D8AK-026 XT:CIC DRAM 128GBIT VFBGA |
3,936 |
|
- |
- | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | - | - | - | - | - | - | - | - | - | - | - |
|
MT62F1G128D8AK-031 XT:BIC DRAM 128GBIT FBGA |
4,458 |
|
- |
- | - | Tray | Active | - | - | DRAM | SDRAM - Mobile LPDDR5 | 128Gbit | 1G x 128 | - | - | - | - | - | - | - | - | - | - |
|
EM064LXQAB313ES2RIC RAM 64MBIT XSPI 24TBGA |
1,479 |
|
- |
EMxxLX | 24-TBGA | Tape & Reel (TR) | Active | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 64Mbit | 8M x 8 | SPI - Quad I/O | 200 MHz | - | - | 1.65V ~ 2V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 24-TBGA (6x8) |
|
EM064LXQADG13ES2RIC RAM 64MBIT XSPI 8DFN |
1,025 |
|
- |
EMxxLX | 8-VDFN Exposed Pad | Tape & Reel (TR) | Active | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 64Mbit | 8M x 8 | SPI - Quad I/O | 200 MHz | - | - | 1.65V ~ 2V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 8-DFN (6x8) |
|
EM064LXQAB313ES2TIC RAM 64MBIT XSPI 24TBGA |
3,687 |
|
- |
EMxxLX | 24-TBGA | Tray | Active | - | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 64Mbit | 8M x 8 | SPI - Quad I/O | 200 MHz | - | - | 1.65V ~ 2V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 24-TBGA (6x8) |
|
MT53E1G64D4NW-046 WT:CIC DRAM 64GBIT 432VFBGA |
2,360 |
|
- |
- | 432-VFBGA | Tray | Active | Not Verified | - | DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | - | - | - | - | - | - | - | - | - | Surface Mount | 432-VFBGA (15x15) |
|
MT53E1G64D4NW-046 WT:C TRIC DRAM 64GBIT 432VFBGA |
3,742 |
|
- |
- | 432-VFBGA | Tape & Reel (TR) | Active | Not Verified | - | DRAM | SDRAM - Mobile LPDDR4X | 64Gbit | - | - | - | - | - | - | - | - | - | Surface Mount | 432-VFBGA (15x15) |
|
CY14B108L-ZS25XITIC NVSRAM 8MBIT PAR 44TSOP II |
2,628 |
|
Datasheet |
- | 44-TSOP (0.400", 10.16mm Width) | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 8Mbit | 1M x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 44-TSOP II |
|
CY14B108L-ZS25XIIC NVSRAM 8MBIT PAR 44TSOP II |
4,915 |
|
Datasheet |
- | 44-TSOP (0.400", 10.16mm Width) | Tray | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 8Mbit | 1M x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 44-TSOP II |
|
CY14B108N-BA25XITIC NVSRAM 8MBIT PARALLEL 48FBGA |
3,690 |
|
Datasheet |
- | 48-TFBGA | Tape & Reel (TR) | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 8Mbit | 512K x 16 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-FBGA (6x10) |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Memory components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.