| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
D2516AN9EXGXNI-UITEMP 4GB 96 BALL FBGA DDR4 3200 |
1,471 |
|
Datasheet |
- | 96-FBGA | Tray | Active | - | - | DRAM | SDRAM - DDR4 | 16bit | 256 x 16 | - | - | - | - | 1.2V | -40°C ~ 95°C | - | - | - | - |
|
FEMC008GSTE9-T14-16IC FLASH 64MBIT EMMC 153FBGA |
1,787 |
|
Datasheet |
XTRA III | 153-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (MLC) | 64Gbit | 8G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 153-FBGA (11.5x13) |
|
TH58NVG3S0HTA00IC FLASH 8GBIT PARALLEL 48TSOP I |
1,689 |
|
Datasheet |
- | 48-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
TH58BVG3S0HTA00IC FLASH 8GBIT PARALLEL 48TSOP I |
4,892 |
|
Datasheet |
Benand™ | 48-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 8Gbit | 1G x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
AS4C256M16D4A-62BINIC DRAM 4GBIT POD 96FBGA |
4,816 |
|
Datasheet |
- | 96-TFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - DDR4 | 4Gbit | 256M x 16 | POD | 1.6 GHz | 15ns | 18 ns | 1.14V ~ 1.26V | -40°C ~ 95°C (TC) | - | - | Surface Mount | 96-FBGA (7.5x13) |
|
S29GL512T12TFVV10IC FLASH 512MBIT PARALLEL 56TSOP |
1,117 |
|
Datasheet |
GL-T | 56-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | Parallel | - | 60ns | 120 ns | 1.65V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 56-TSOP |
|
|
MR256A08BCYS35IC RAM 256KBIT PARALLEL 44TSOP2 |
2,254 |
|
Datasheet |
- | 44-TSOP (0.400", 10.16mm Width) | Tray | Active | Not Verified | Non-Volatile | RAM | MRAM (Magnetoresistive RAM) | 256Kbit | 32K x 8 | Parallel | - | 35ns | 35 ns | 3V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 44-TSOP2 |
|
CY14B101J2-SXIIC NVSRAM 1MBIT I2C 3.4MHZ 8SOIC |
2,660 |
|
Datasheet |
- | 8-SOIC (0.154", 3.90mm Width) | Tube | Active | Not Verified | Non-Volatile | NVSRAM | NVSRAM (Non-Volatile SRAM) | 1Mbit | 128K x 8 | I2C | 3.4 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-SOIC |
|
FM8G00EMCV3RBFIINDUSTRIAL TEMP. -40C TO +85C 11 |
4,110 |
|
- |
- | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
S29GL512T11TFV020IC FLASH 512MBIT PARALLEL 56TSOP |
2,535 |
|
Datasheet |
GL-T | 56-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 512Mbit | 64M x 8 | Parallel | - | 60ns | 110 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 56-TSOP |
|
S26KL256SDABHV020IC FLASH 256MBIT HYPERBUS 24FBGA |
2,721 |
|
Datasheet |
HYPERFLASH™ KL | 24-VBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 256Mbit | 32M x 8 | HyperBus | 100 MHz | - | 96 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 24-FBGA (6x8) |
|
EMMC32G-TS0A-01011IC FLASH 256GBIT EMMC 153WFBGA |
3,381 |
|
- |
e•MMC™ | 153-VFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (TLC) | 256Gbit | 32G x 8 | eMMC_5.1 | 200 MHz | - | - | 2.7V ~ 3.6V | -25°C ~ 85°C | - | - | Surface Mount | 153-FBGA (11.5x13) |
|
IS25WP01GG-RHLEIC FLASH 1GBIT SPI/QUAD |
4,456 |
|
Datasheet |
- | 24-TBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NOR (SLC) | 1Gbit | 128M x 8 | SPI - Quad I/O, QPI, DTR | 133 MHz | 70µs | 6 ns | 1.65V ~ 1.95V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 24-TFBGA (6x8) |
|
AS4C128M16MD4V-062BANIC DRAM 2GBIT LVSTL 200FBGA |
1,574 |
|
Datasheet |
- | 200-WFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | 128M x 16 | LVSTL | 1.6 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Automotive | AEC-Q100 | Surface Mount | 200-FBGA (10x14.5) |
|
FM16G0EMCV3RBFCCOMMERCIAL TEMP. -25C TO +85C 11 |
3,606 |
|
- |
- | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
D0811PM2FDGUKW-UIC DRAM 8GBIT 200FBGA |
3,892 |
|
Datasheet |
LPDDR4 | - | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4 | 8Gbit | 512M x 16 | - | - | - | - | - | -40°C ~ 95°C | - | - | Surface Mount | 200-FBGA (10x14.5) |
|
CY7C1361C-100BZXEIC SRAM 9MBIT PAR 165FBGA |
4,620 |
|
Datasheet |
- | 165-LBGA | Tray | Active | Not Verified | Volatile | SRAM | SRAM - Synchronous, SDR | 9Mbit | 256K x 36 | Parallel | 100 MHz | - | 8.5 ns | 3.135V ~ 3.6V | -40°C ~ 125°C (TA) | - | - | Surface Mount | 165-FBGA (13x15) |
|
SFEM004GB2ED1TO-I-5E-111-STDIC FLASH 32GBIT EMMC 153BGA |
3,646 |
|
Datasheet |
EM-30 | 153-TFBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NAND (TLC) | 32Gbit | 4G x 8 | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | - | - | Surface Mount | 153-BGA (11.5x13) |
|
AS4C512M32MD4V-053BINIC DRAM 16GBIT LVSTLE 200FBGA |
1,826 |
|
Datasheet |
- | 200-VFBGA | Tray | Active | - | Volatile | DRAM | SDRAM - Mobile LPDDR4X | 16Gbit | 512M x 32 | LVSTLE_06 | 1.866 GHz | 18ns | 3.5 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | - | - | Surface Mount | 200-FBGA (10x15) |
|
IS61NLF51236B-6.5TQLIIC SRAM 18MBIT PAR 100LQFP |
4,699 |
|
Datasheet |
- | 100-LQFP | Tray | Active | - | Volatile | SRAM | SRAM - Synchronous, ZBT | 18Mbit | 512K x 36 | Parallel | 133 MHz | - | 6.5 ns | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 100-LQFP (14x20) |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Memory components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.