| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Programmable | Memory Type | Memory Format | Technology | Memory Size | Memory Organization | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
S25FL064LABNFM040IC FLASH 64MBIT SPI/QUAD 8USON |
2,679 |
|
Datasheet |
FL-L | 8-UDFN Exposed Pad | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 64Mbit | 8M x 8 | SPI - Quad I/O, QPI | 108 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | - | - | Surface Mount | 8-USON (4x4) |
|
W9825G6KH-5IC DRAM 256MBIT PAR 54TSOP II |
2,722 |
|
Datasheet |
- | 54-TSOP (0.400", 10.16mm Width) | Tray | Active | Not Verified | Volatile | DRAM | SDRAM | 256Mbit | 16M x 16 | Parallel | 200 MHz | - | 5 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 54-TSOP II |
|
W9825G6KH-6 TRIC DRAM 256MBIT PAR 54TSOP II |
2,610 |
|
Datasheet |
- | 54-TSOP (0.400", 10.16mm Width) | Tape & Reel (TR) | Active | Not Verified | Volatile | DRAM | SDRAM | 256Mbit | 16M x 16 | Parallel | 166 MHz | - | 5 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 54-TSOP II |
|
TC58NVG1S3HBAI6IC FLASH 2GBIT PARALLEL 67VFBGA |
3,883 |
|
Datasheet |
- | 67-VFBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 67-VFBGA (6.5x8) |
|
MT29F1G08ABAFAH4-AAT:FIC FLASH 1GBIT PARALLEL 63VFBGA |
2,589 |
|
- |
- | 63-VFBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 1Gbit | 128M x 8 | Parallel | - | 20ns | 20 ns | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount | 63-VFBGA (9x11) |
|
S29AL008J70BFN020IC FLASH 8MBIT PARALLEL 48FBGA |
4,293 |
|
Datasheet |
AL-J | 48-VFBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NOR | 8Mbit | 1M x 8, 512K x 16 | Parallel | - | 70ns | 70 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | - | - | Surface Mount | 48-FBGA (8.15x6.15) |
|
BR24H1MFJ-5ACE2IC EEPROM 1MBIT I2C 8SOPJ |
4,698 |
|
Datasheet |
- | 8-SOIC (0.154", 3.90mm Width) | Tape & Reel (TR) | Active | - | Non-Volatile | EEPROM | EEPROM | 1Mbit | 128K x 8 | I2C | 1 MHz | 3.5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 8-SOP-J |
|
BR25H1MFVT-5ACE21MBIT, SPI BUS, HIGH SPEED WRITE |
1,612 |
|
Datasheet |
BR25H1Mxxx-5AC | 8-TSSOP (0.173", 4.40mm Width) | Tape & Reel (TR) | Active | - | Non-Volatile | EEPROM | EEPROM | 1Mbit | 128K x 8 | SPI | 20 MHz | 3.5ms | - | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 8-TSSOP-B |
|
BR24H1MFVT-5ACE21M BIT, ISUP2;C (2-WIRE) BUS, HI |
4,967 |
|
Datasheet |
BR24H1Mxxx-5AC | 8-TSSOP (0.173", 4.40mm Width) | Tape & Reel (TR) | Active | - | Non-Volatile | EEPROM | EEPROM | 1Mbit | 128K x 8 | I2C | 1 MHz | 3.5ms | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 8-TSSOP-B |
|
W25N01KWZPIGIC FLASH 1GBIT SPI/QUAD 8WSON |
3,000 |
|
- |
SpiFlash® | 8-WDFN Exposed Pad | Tube | Active | - | Non-Volatile | FLASH | FLASH - NOR (SLC) | 1Gbit | 128M x 8 | SPI - Quad I/O | 104 MHz | 700µs | 7 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-WSON (6x5) |
|
AT25QF2561C-SUB-T8-pin 208 mil W-SOIC, IND TEP |
3,100 |
|
- |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
IS25LP256D-RMLA3-TY256MB QSPI 16-SOIC 300MIL AUTO |
1,498 |
|
- |
IS25xP | 16-SOIC (0.295", 7.50mm Width) | Tray | Active | - | Non-Volatile | FLASH | FLASH - NOR (SLC) | 256Mbit | 32M x 8 | SPI - Quad I/O, QPI, DTR | 166 MHz | 40µs, 800µs | 6.5 ns | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 16-SOIC |
|
IS25LP256D-RHLA3256MB QSPI 24TFBGA 6X8MM, AUTO |
1,191 |
|
- |
IS25xP | 24-TBGA | Tray | Active | - | Non-Volatile | FLASH | FLASH - NOR (SLC) | 256Mbit | 32M x 8 | SPI - Quad I/O, QPI, DTR | 166 MHz | 40µs, 800µs | 6.5 ns | 2.3V ~ 3.6V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 24-TFBGA (6x8) |
|
TC58BYG0S3HBAI4IC FLASH 1GBIT PARALLEL 63TFBGA |
2,389 |
|
Datasheet |
Benand™ | 63-VFBGA | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 1Gbit | 128M x 8 | - | - | 25ns | - | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 63-TFBGA (9x11) |
|
W989D6DBGX6IIC DRAM 512MBIT PAR 54VFBGA |
4,463 |
|
Datasheet |
- | 54-TFBGA | Tray | Active | Not Verified | Volatile | DRAM | SDRAM - Mobile LPSDR | 512Mbit | 32M x 16 | Parallel | 166 MHz | 15ns | 5 ns | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 54-VFBGA (8x9) |
|
AS4C2M32SA-7TCNIC DRAM 64MBIT PAR 86TSOP II |
2,561 |
|
Datasheet |
- | 86-TFSOP (0.400", 10.16mm Width) | Tray | Active | Not Verified | Volatile | DRAM | SDRAM | 64Mbit | 2M x 32 | Parallel | 143 MHz | 2ns | 5.5 ns | 3V ~ 3.6V | 0°C ~ 70°C (TA) | - | - | Surface Mount | 86-TSOP II |
|
TC58BVG1S3HTAI0IC FLASH 2GBIT PARALLEL 48TSOP I |
1,744 |
|
Datasheet |
Benand™ | 48-TFSOP (0.724", 18.40mm Width) | Tray | Active | Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
TC58NVG1S3HTAI0IC FLASH 2GBIT PARALLEL 48TSOP I |
4,249 |
|
Datasheet |
- | 48-TFSOP (0.724", 18.40mm Width) | Tray | Active | Not Verified | Non-Volatile | FLASH | FLASH - NAND (SLC) | 2Gbit | 256M x 8 | Parallel | - | 25ns | 25 ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-TSOP I |
|
MB85RC256TYPNF-GS-BCERE1256kbit FRAM |
2,329 |
|
Datasheet |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
MB85RC256TYPN-GS-AWEWE1256kbit FRAM |
1,416 |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Memory components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.