| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MVR5510AMBANESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
1,509 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC34FS6408NAER2SYSTEM BASIS CHIP CAN 5V 1.5 NXP USA Inc. |
3,360 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 13mA | 2.7V ~ 36V | -40°C ~ 125°C (TA) | - | - | Surface Mount | 48-HLQFP (7x7) |
|
MC34702EKIC POWER SUPPLY MCU 3A 32-SOIC NXP USA Inc. |
2,141 | - |
|
Datasheet |
- | 32-BSSOP (0.295", 7.50mm Width) | Tube | Obsolete | Power Supplies | 60mA | 2.8V ~ 6V | -40°C ~ 85°C | - | - | Surface Mount | 32-SOIC |
|
MC35FS6518CAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
4,481 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MVR5510AMMA4ESIC PMIC VR5510 NXP USA Inc. |
2,982 | - |
|
- |
- | 56-VFQFN Exposed Pad | Tray | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MVR5510AMMAHESIC PMIC VR5510 QM NXP USA Inc. |
4,467 | - |
|
- |
- | 56-VFQFN Exposed Pad | Tray | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MVR5510AMMA6ESIC PMIC VR5510 QM NXP USA Inc. |
4,392 | - |
|
- |
- | 56-VFQFN Exposed Pad | Tray | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MVR5510AMMA0ESIC PMIC VR5510 QM NXP USA Inc. |
3,559 | - |
|
- |
- | 56-VFQFN Exposed Pad | Tray | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC35FS6511CAEFS6500 NXP USA Inc. |
3,618 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS8530A1ESR2SYSTEM BASIS CHIP FS8500 NXP USA Inc. |
4,208 | - |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |