| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC34PF8100CHEPR2POWER MANAGEMENT IC, I.MX8, PRE- NXP USA Inc. |
4,000 | - |
|
Datasheet |
* | - | Bulk | Active | - | - | - | - | - | - | - | - |
|
MC34PF8100CHEPPOWER MANAGEMENT IC, I.MX8, PRE- NXP USA Inc. |
780 | - |
|
Datasheet |
* | - | Bulk | Active | - | - | - | - | - | - | - | - |
|
MWPR1024IZVHTRF and Baseband Circuit NXP Semiconductors |
1,015 | - |
|
- |
- | 64-VFLGA | Tray | Active | Wireless Power Receiver | 120mA | 1.71V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 64-VFLGA (7x7) |
|
MWCT1R24ZVHTTelecom Circuit NXP Semiconductors |
525 | - |
|
- |
- | 64-VFLGA | Tray | Active | Wireless Power Transmitter | - | 2.7V ~ 3.6V | -40°C ~ 105°C | - | - | Surface Mount | 64-VFLGA (7x7) |
|
MC33PF8200D2ESMC33PF8200D2ES - Power Managemen NXP Semiconductors |
368 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Bulk | Active | - | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MWCT1213AVLHPower Supply Management Circuit, NXP Semiconductors |
580 | - |
|
- |
- | 64-LQFP | Tray | Active | Wireless Power Transmitter | 300µA | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount | 64-LQFP (10x10) |
|
MC33907LAER2MC33907 - System Basis chip, DCD NXP Semiconductors |
15,950 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Bulk | Active | System Basis Chip | 3.5mA | 3.3V, 5V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP (7x7) |
|
MFS2633AMDA0ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
2,809 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | 29µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-LQFP-EP (7x7) |
|
MC33PF8100A0ESIC POWER MANAGEMENT NXP USA Inc. |
2,616 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33664ATL1EGTRANSFORMER PHYSICAL LAYER NXP USA Inc. |
4,023 | - |
|
Datasheet |
- | 16-SOIC (0.154", 3.90mm Width) | Tube | Active | Isolated Communications Interface | 40mA | 4.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount | 16-SOIC |