| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC32PF3000A5EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
1,080 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MC32PF3000A6EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
2,518 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MC32PF3000A8EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
4,347 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MC32PF4210A3ESR2PF4210 NXP USA Inc. |
2,803 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Audio, Video | - | 2.8V ~ 4.5V | 0°C ~ 85°C (TA) | - | - | Surface Mount, Wettable Flank | 56-QFN-EP (8x8) |
|
MC32PF4210A2ESR2PF4210 NXP USA Inc. |
1,407 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Audio, Video | - | 2.8V ~ 4.5V | 0°C ~ 85°C (TA) | - | - | Surface Mount, Wettable Flank | 56-QFN-EP (8x8) |
|
MC32PF4210A4ESR2PF4210 NXP USA Inc. |
1,626 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Audio, Video | - | 2.8V ~ 4.5V | 0°C ~ 85°C (TA) | - | - | Surface Mount, Wettable Flank | 56-QFN-EP (8x8) |
|
MC33FS4500LAER2SYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
4,664 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS4501NAER2SYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
1,594 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
|
MPF5200AMBA1ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
3,123 | - |
|
Datasheet |
- | 32-PowerWFQFN | Tape & Reel (TR) | Active | - | - | - | - | - | - | Surface Mount, Wettable Flank | 32-HWQFN (5x5) |
|
MPF5200AMBA2ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
3,673 | - |
|
Datasheet |
- | 32-PowerWFQFN | Tape & Reel (TR) | Active | - | - | - | - | - | - | Surface Mount, Wettable Flank | 32-HWQFN (5x5) |