| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MPF5200AMBA2ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
1,431 | - |
|
Datasheet |
- | 32-PowerWFQFN | Tray | Active | - | 40µA | 2.7V ~ 5.5V | -40°C ~ 125°C | Automotive | - | Surface Mount, Wettable Flank | 32-HWQFN (5x5) |
|
MPF5200AMBA3ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
2,221 | - |
|
Datasheet |
- | 32-PowerWFQFN | Tray | Active | - | 40µA | 2.7V ~ 5.5V | -40°C ~ 125°C | Automotive | - | Surface Mount, Wettable Flank | 32-HWQFN (5x5) |
|
MPF5200AMBA1ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
1,812 | - |
|
Datasheet |
- | 32-PowerWFQFN | Tray | Active | - | 40µA | 2.7V ~ 5.5V | -40°C ~ 125°C | Automotive | - | Surface Mount, Wettable Flank | 32-HWQFN (5x5) |
|
MC33FS6507CAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
1,398 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33PF8101A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
4,553 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF3000A3ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
4,430 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
|
MC33PF3000A4ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,045 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
|
MC33PF3000A5ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
4,936 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
|
MC33PF3000A6ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
2,544 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
|
MC33FS8410G3ESR2SYSTEM BASIS CHIP FS8410 NXP USA Inc. |
3,940 | - |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |