| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33FS8500A0KSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
2,555 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS8500A0ESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
4,761 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MWCT1013VLHSTR32BIT256K FLASHSTR CTM NXP USA Inc. |
3,141 | - |
|
- |
- | 64-LQFP | Tape & Reel (TR) | Obsolete | General Purpose | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 64-LQFP (10x10) |
|
MC33FS6507KAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
3,695 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS5502Y3KSHIGH VOLTAGE POWER MANAGEMENT IC NXP USA Inc. |
4,204 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | SMPS Start-Up | - | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS5502Y0KSHIGH VOLTAGE POWER MANAGEMENT IC NXP USA Inc. |
4,938 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | SMPS Start-Up | - | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC35FS6507NAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
3,597 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS4501CAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
2,292 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
|
MFS2603AMBA0ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
4,375 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | - | - | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
|
MC34PF4210A4ESR2PF4210 NXP USA Inc. |
4,683 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Audio, Video | - | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-QFN-EP (8x8) |