| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF8100ERESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,121 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8100CHESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,529 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8100A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
2,283 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MWCT1013VLHST32BIT256K FLASHSTR CTM NXP USA Inc. |
2,827 | - |
|
- |
- | 64-LQFP | Tray | Obsolete | General Purpose | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 64-LQFP (10x10) |
|
MFS8416AMBP0ESR2SAFETY POWER MANAGEMENT IC, QFN4 NXP USA Inc. |
4,724 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 2.7V ~ 60V | -40°C ~ 125°C | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS8416AMBP5ESR2SAFETY POWER MANAGEMENT IC, QFN4 NXP USA Inc. |
3,986 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS8416AMBP3ESR2SAFETY POWER MANAGEMENT IC, QFN4 NXP USA Inc. |
4,760 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MC35FS6507CAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
2,842 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS6512CAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
2,932 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS6527KAESYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
2,782 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |