| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF8100EAESIC POWER MANAGEMENT LS1046A |
1,437 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8100ERESIC POWER MANAGEMENT I.MX8QM |
1,740 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
LM2984T/NOPBIC CONV MICROPROCESSOR TO220-11 |
3,388 |
|
Datasheet |
- | TO-220-11 Formed Leads | Tube | Obsolete | Power Supplies | 100mA | 6V ~ 26V | -40°C ~ 125°C | - | - | Through Hole | TO-220-11 |
|
MC35FS4503NAER2FS4500 |
2,720 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MAX17031ETG+TIC CTLR DUAL QUICK PWM SD 24TQFN |
2,437 |
|
Datasheet |
Quick-PWM™ | 24-WFQFN Exposed Pad | Tape & Reel (TR) | Active | Power Supplies | 100µA | 6V ~ 24V | -40°C ~ 85°C | - | - | Surface Mount | 24-TQFN (4x4) |
|
MC33FS8435G0ESR2SAFETY POWER MANAGEMENT IC, QFN5 |
3,025 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS8435G0KSR2SAFETY POWER MANAGEMENT IC, QFN5 |
2,817 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC35FS6512NAEFS6500 |
4,009 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
AMP8DS1QF74MULTI-RAIL POWER PLATFORM 1A |
2,596 |
|
Datasheet |
- | 74-PowerWFQFN | Tape & Reel (TR) | Active | Battery Charger, Digital Power Management, Power Component Integrator | 1A | 12V | -40°C ~ 85°C (TA) | - | - | Surface Mount | 74-QFN (8x8) |
|
MC35FS4507CAESYSTEM BASIS CHIP, LINEAR 0.5A V |
3,952 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS8430G2ESSYSTEM BASIS CHIP FS8430 |
2,972 |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC33FS8430G4ESSYSTEM BASIS CHIP FS8430 |
2,005 |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC33PF8200DEESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
4,111 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200D2ESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
1,542 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
2,374 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
2,245 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
3,104 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR |
3,784 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
4,610 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
2,699 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Power Management - Specialized components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.