| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC35FS6503CAER2FS6500 |
3,857 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MAX20069BGTLA/V+AUTOMOTIVE I2C-CONTROLLED 4-CHAN |
1,078 |
|
Datasheet |
- | 40-WFQFN Exposed Pad | Tube | Active | TFT-LCD Panels: Gamma Buffer, VCOM Driver | 2.2mA | 2.8V ~ 5.5V, 4.5V ~ 42V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 40-TQFN (6x6) |
|
MAX5043ETN+TIC PWR W/MOSFET HS 56-TQFN |
4,818 |
|
- |
- | 56-WFQFN Exposed Pad | Tape & Reel (TR) | Obsolete | General Purpose | 20mA | 20V ~ 76V | -40°C ~ 85°C | - | - | Surface Mount | 56-TQFN (8x8) |
|
MC33FS6600M0ESR2SAFETY SBC FOR S32S2 MCU |
3,857 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Safety | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS6600M1ESR2SAFETY SBC FOR S32S2 MCU |
3,830 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Safety | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS6600M2ESR2SAFETY SBC FOR S32S2 MCU |
2,583 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Safety | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200CXESIC POWER MANAGEMENT LS1043A |
4,422 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DBESIC POWER MANAGEMENT I.MX8QM |
4,551 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DFESI.MX8QXP WITH DDR3L |
1,666 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DHESIC POWER MANAGEMENT I.MX8QM |
1,678 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200ESESIC POWER MANAGEMENT I.MX8QM |
2,394 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200ETESIC POWER MANAGEMENT I.MX8QM |
1,934 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DMESPOWER MANAGEMENT IC I.MX8 PRE-PR |
1,489 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DNESPOWER MANAGEMENT IC I.MX8 PRE-PR |
4,646 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200EMESPOWER MANAGEMENT IC I.MX8 PRE-PR |
1,760 |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS6600M2KSR2SAFETY POWER MANAGEMENT IC, QFN5 |
1,864 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS6600M1KSR2SAFETY POWER MANAGEMENT IC, QFN5 |
3,038 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS6600M0KSR2SAFETY POWER MANAGEMENT IC, QFN5 |
4,602 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
P9025AC-RNBGI8IC WIRELESS PWR RECEIVER 32VFQFN |
4,895 |
|
Datasheet |
- | 32-WFQFN Exposed Pad | Tape & Reel (TR) | Obsolete | Wireless Power Receiver | - | - | 0°C ~ 85°C | - | - | Surface Mount | 32-VFQFPN (5x5) |
|
MD1730T-V/M2IC ULTRASOUND IMAGING 36VQFN |
1,672 |
|
Datasheet |
- | 36-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Ultrasound Imaging | - | 4.75V ~ 5.25V | 0°C ~ 85°C | - | - | Surface Mount | 36-SQFN (6x6) |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Power Management - Specialized components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.