Single Diodes

Manufacturer Series Package/Case Packaging Product Status Technology Voltage - DC Reverse (Vr) (Max) Current - Average Rectified (Io) Voltage - Forward (Vf) (Max) @ If Speed Reverse Recovery Time (trr) Current - Reverse Leakage @ Vr Capacitance @ Vr, F Grade Qualification Mounting Type Supplier Device Package Operating Temperature - 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Photo Mfr. Part # Availability Price Quantity Datasheet Series Package/Case Packaging Product Status Technology Voltage - DC Reverse (Vr) (Max) Current - Average Rectified (Io) Voltage - Forward (Vf) (Max) @ If Speed Reverse Recovery Time (trr) Current - Reverse Leakage @ Vr Capacitance @ Vr, F Grade Qualification Mounting Type Supplier Device Package Operating Temperature - Junction
20ETF06FP Vishay General Semiconductor - Diodes Division

20ETF06FP

DIODE GP 600V 20A TO220ACFP

Vishay General Semiconductor - Diodes Division

8,502
RFQ
20ETF06FP Datasheet

Datasheet

- TO-220-2 Full Pack Tube Obsolete Standard 600 V 20A 1.3 V @ 20 A Fast Recovery =< 500ns, > 200mA (Io) 160 ns 100 µA @ 600 V - - - Through Hole TO-220AC Full Pack -40°C ~ 150°C
SD200SA30B.T1 SMC Diode Solutions

SD200SA30B.T1

DIODE SCHOTTKY 30V 60A DIE

SMC Diode Solutions

6,877
RFQ
SD200SA30B.T1 Datasheet

Datasheet

- Die Tray Active Schottky 30 V 60A 530 mV @ 60 A Fast Recovery =< 500ns, > 200mA (Io) - 6 mA @ 30 V 3300pF @ 5V, 1MHz - - Surface Mount Die -55°C ~ 150°C
SD200SA60B.T1 SMC Diode Solutions

SD200SA60B.T1

DIODE SCHOTTKY 60V 60A DIE

SMC Diode Solutions

6,877
RFQ
SD200SA60B.T1 Datasheet

Datasheet

- Die Tray Active Schottky 60 V 60A 680 mV @ 60 A Fast Recovery =< 500ns, > 200mA (Io) - 6 mA @ 60 V 2400pF @ 5V, 1MHz - - Surface Mount Die -55°C ~ 150°C
VS-HFA06TB120PBF Vishay General Semiconductor - Diodes Division

VS-HFA06TB120PBF

DIODE GEN PURP 1.2KV 6A TO220AC

Vishay General Semiconductor - Diodes Division

3,757
RFQ
VS-HFA06TB120PBF Datasheet

Datasheet

HEXFRED® TO-220-2 Tube Obsolete Standard 1200 V 6A 3 V @ 6 A Fast Recovery =< 500ns, > 200mA (Io) 80 ns 5 µA @ 1200 V - - - Through Hole TO-220AC -55°C ~ 150°C
UX-G5B Sanken Electric USA Inc.

UX-G5B

DIODE GEN PURP 7.5KV 350MA AXIAL

Sanken Electric USA Inc.

4,154
RFQ
UX-G5B Datasheet

Datasheet

- Axial Bulk Active Standard 7500 V 350mA 13.5 V @ 350 mA Fast Recovery =< 500ns, > 200mA (Io) 150 ns 10 µA @ 7500 V - - - Through Hole Axial 120°C
SIDC08D60C6 Infineon Technologies

SIDC08D60C6

DIODE GP 600V 30A WAFER

Infineon Technologies

7,497
RFQ
SIDC08D60C6 Datasheet

Datasheet

- Die Bulk Discontinued at Digi-Key Standard 600 V 30A 1.95 V @ 30 A Standard Recovery >500ns, > 200mA (Io) - 27 µA @ 600 V - - - Surface Mount Sawn on foil -40°C ~ 175°C
CDLL6675 Microchip Technology

CDLL6675

DIODE SCHOTTKY 20V 200MA DO213AA

Microchip Technology

7,027
RFQ
CDLL6675 Datasheet

Datasheet

- DO-213AA Bulk Active Schottky 20 V 200mA 500 mV @ 200 mA Small Signal =< 200mA (Io), Any Speed - 5 µA @ 20 V 50pF @ 0V, 1MHz - - Surface Mount DO-213AA -65°C ~ 125°C
JANTX1N4150UR-1/TR Microchip Technology

JANTX1N4150UR-1/TR

DIODE GEN PURP 50V 200MA DO213AA

Microchip Technology

2,643
RFQ

-

- DO-213AA Tape & Reel (TR) Active Standard 50 V 200mA 1 V @ 200 mA Small Signal =< 200mA (Io), Any Speed 4 ns 100 nA @ 50 V - Military MIL-PRF-19500/231 Surface Mount DO-213AA -65°C ~ 175°C
PCFF55H120SWF onsemi

PCFF55H120SWF

1200V/55A GEN7 FRD HS SAWN-ON-FO

onsemi

6,134
RFQ
PCFF55H120SWF Datasheet

Datasheet

- Die Tray Active Standard 1200 V 55A 2.08 V @ 55 A Fast Recovery =< 500ns, > 200mA (Io) 287.4 ns 10 µA @ 1200 V - - - Surface Mount Wafer -40°C ~ 175°C
UPS3200/TR13 Microchip Technology

UPS3200/TR13

DIODE SCHOTTKY 3A 200V POWERMITE

Microchip Technology

4,740
RFQ

-

* - Tape & Reel (TR) Active - - - - - - - - - - - - -
SPV1002T40 STMicroelectronics

SPV1002T40

DIODE GEN PURP 40V 16A TO220

STMicroelectronics

3,302
RFQ
SPV1002T40 Datasheet

Datasheet

- TO-220-3 Tube Obsolete Standard 40 V 16A 180 mV @ 16 A - - 1 µA @ 40 V - - - Through Hole TO-220 -45°C ~ 175°C
CBR06P65HL Bruckewell

CBR06P65HL

SIC SCHOTTKY DIODE,650V,6A,DFN 8

Bruckewell

1,322
RFQ

-

- 4-PowerTSFN Cut Tape (CT) Active SiC (Silicon Carbide) Schottky 650 V 18A 1.7 V @ 6 A No Recovery Time > 500mA (Io) 0 ns 20 µA @ 650 V - - - Surface Mount 4-DFN (8x8) -55°C ~ 150°C
BYW77G-200-TR STMicroelectronics

BYW77G-200-TR

DIODE GEN PURP 200V 25A D2PAK

STMicroelectronics

8,287
RFQ
BYW77G-200-TR Datasheet

Datasheet

- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB Tape & Reel (TR) Obsolete Standard 200 V 25A 1.15 V @ 40 A Fast Recovery =< 500ns, > 200mA (Io) 50 ns 25 µA @ 200 V - - - Surface Mount D2PAK -40°C ~ 150°C
UFS530GE3/TR13 Microchip Technology

UFS530GE3/TR13

DIODE GEN PURP 300V 5A DO215AB

Microchip Technology

5,531
RFQ
UFS530GE3/TR13 Datasheet

Datasheet

- DO-215AB, SMC Gull Wing Tape & Reel (TR) Active Standard 300 V 5A 1.2 V @ 5 A Fast Recovery =< 500ns, > 200mA (Io) 50 ns 10 µA @ 300 V - - - Surface Mount DO-215AB -55°C ~ 175°C
UFS305J/TR13 Microchip Technology

UFS305J/TR13

DIODE GEN PURP 50V 3A DO214AB

Microchip Technology

8,793
RFQ
UFS305J/TR13 Datasheet

Datasheet

- DO-214AB, SMC Tape & Reel (TR) Active Standard 50 V 3A 950 mV @ 3 A Fast Recovery =< 500ns, > 200mA (Io) 30 ns 10 µA @ 50 V - - - Surface Mount DO-214AB -55°C ~ 175°C
UFS310J/TR13 Microchip Technology

UFS310J/TR13

DIODE GEN PURP 100V 3A DO214AB

Microchip Technology

9,376
RFQ
UFS310J/TR13 Datasheet

Datasheet

- DO-214AB, SMC Tape & Reel (TR) Active Standard 100 V 3A 950 mV @ 3 A Fast Recovery =< 500ns, > 200mA (Io) 30 ns 10 µA @ 100 V - - - Surface Mount DO-214AB -55°C ~ 175°C
UFS315J/TR13 Microchip Technology

UFS315J/TR13

DIODE GEN PURP 150V 3A DO214AB

Microchip Technology

2,498
RFQ
UFS315J/TR13 Datasheet

Datasheet

- DO-214AB, SMC Tape & Reel (TR) Active Standard 150 V 3A 950 mV @ 3 A Fast Recovery =< 500ns, > 200mA (Io) 30 ns 10 µA @ 150 V - - - Surface Mount DO-214AB -55°C ~ 175°C
UFS320J/TR13 Microchip Technology

UFS320J/TR13

DIODE GEN PURP 200V 3A DO214AB

Microchip Technology

6,363
RFQ
UFS320J/TR13 Datasheet

Datasheet

- DO-214AB, SMC Tape & Reel (TR) Active Standard 200 V 3A 950 mV @ 3 A Fast Recovery =< 500ns, > 200mA (Io) 30 ns 10 µA @ 200 V - - - Surface Mount DO-214AB -55°C ~ 175°C
UFS330J/TR13 Microchip Technology

UFS330J/TR13

DIODE GEN PURP 300V 3A DO214AB

Microchip Technology

6,322
RFQ
UFS330J/TR13 Datasheet

Datasheet

- DO-214AB, SMC Tape & Reel (TR) Active Standard 300 V 3A 1.1 V @ 3 A Fast Recovery =< 500ns, > 200mA (Io) 50 ns 10 µA @ 300 V - - - Surface Mount DO-214AB -55°C ~ 175°C
UFS340J/TR13 Microchip Technology

UFS340J/TR13

DIODE GEN PURP 400V 3A DO214AB

Microchip Technology

2,522
RFQ
UFS340J/TR13 Datasheet

Datasheet

- DO-214AB, SMC Tape & Reel (TR) Active Standard 400 V 3A 1.1 V @ 3 A Fast Recovery =< 500ns, > 200mA (Io) 50 ns 10 µA @ 400 V - - - Surface Mount DO-214AB -55°C ~ 175°C

Single Diodes Electronic Components Sourcing and Lifecycle Support

FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Single Diodes components, we support both current production requirements and long-term component availability across demanding product lifecycles.

Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.

How FPGAX Supports Single Diodes Requirements

  • Active component sourcing: support for current FPGA, programmable logic, and related semiconductor requirements.
  • End-of-life sourcing: assistance with obsolete and hard-to-find parts when designs must remain in production.
  • Lifecycle management: sourcing support during product transitions, allocation periods, and supply interruptions.
  • Design continuity: long-term supply support intended to reduce redesign pressure and production disruption.
  • Major programmable logic brands: sourcing coverage includes Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic.

Supply Support at a Glance

Requirement FPGAX Support
Current production Active FPGA, programmable logic, and semiconductor component sourcing
Legacy programs End-of-life and hard-to-find component sourcing
Supply continuity Lifecycle transition and long-term availability support
Quality requirements Traceable sourcing and quality-management processes

Focused on FPGA and Programmable Logic Supply

FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.

Single Diodes FAQ

Can FPGAX source both active and end-of-life Single Diodes components?

Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.

Which programmable logic manufacturers does FPGAX support?

Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.

How does FPGAX help with component lifecycle changes?

We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.

What quality and traceability standards does FPGAX follow?

FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.

What information should I provide for a Single Diodes sourcing request?

Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.