| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Capacitance | Tolerance | Voltage - Rated | Type | ESR (Equivalent Series Resistance) | Operating Temperature | Lifetime @ Temp. | Mounting Type | Size / Dimension | Height - Seated (Max) | Lead Spacing | Manufacturer Size Code | Ratings | Features | Failure Rate | Grade | Qualification |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
THS3100702Wet Tantalum |
3,010 |
|
- |
THS3 | Retail Package | Active | 7 mF | ±20% | 100 V | Hermetically Sealed | 50mOhm | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 1.400" L x 1.400" W (35.56mm x 35.56mm) | 0.625" (15.88mm) | 0.400" (10.16mm) | - | - | Hybrid Wet Tantalum | - | - | - |
|
HC3D060182HTWet Tantalum |
9,803 |
|
- |
HyCap HT | Retail Package | Active | 1.8 mF | ±20% | 36 V | Hermetically Sealed | 600mOhm | -55°C ~ 200°C | - | Through Hole | 0.375" Dia x 1.062" L (9.52mm x 26.97mm) | - | - | D | - | Hybrid Wet Tantalum | - | - | - |
|
HC4D100881HTWet Tantalum |
5,984 |
|
- |
HyCap HT | Retail Package | Active | 880 µF | ±20% | 60 V | Hermetically Sealed | 600mOhm | -55°C ~ 200°C | - | Through Hole | 0.375" Dia x 1.062" L (9.52mm x 26.97mm) | - | - | D | - | Hybrid Wet Tantalum | - | - | - |
|
THQA2025382Wet Tantalum |
6,511 |
|
- |
THQA2 | Retail Package | Active | 3.8 mF | ±20% | 25 V | Hermetically Sealed | 200mOhm | -55°C ~ 125°C | 2000 Hrs @ 85°C | Through Hole | 0.600" Dia (15.24mm) | 0.605" (15.37mm) | 0.200" (5.08mm) | - | - | Hybrid Wet Tantalum | - | - | - |
|
T491R475M010AT4.70UF 10.0V |
4,603 |
|
- |
T491 | Tape & Reel (TR) | Active | 4.7 µF | ±20% | 10 V | Molded | - | -55°C ~ 125°C | 2000 Hrs @ 125°C | Surface Mount | 0.079" L x 0.051" W (2.00mm x 1.30mm) | 0.047" (1.20mm) | - | R | - | General Purpose | - | - | - |
|
TSP3O147M050ATE060H543140.UF 50.0V |
9,484 |
|
- |
TSP | Tray | Active | 140 µF | ±20% | 50 V | Molded | 22mOhm @ 100kHz | -55°C ~ 105°C | 2000 Hrs @ 125°C | Surface Mount | 0.311" L x 0.240" W (7.90mm x 6.10mm) | 0.539" (13.68mm) | - | 3O | - | General Purpose | - | - | - |
|
HC2B050471Wet Tantalum |
7,613 |
|
- |
HyCap | Tray | Active | 470 µF | ±20% | 50 V | Hermetically Sealed | 900mOhm | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 0.281" Dia x 0.641" L (7.14mm x 16.28mm) | - | - | B | - | Hybrid Wet Tantalum | - | - | - |
|
THQ1016303Wet Tantalum |
7,613 |
|
- |
THQ | Box | Active | 30000 µF | ±20% | 16 V | Hermetically Sealed | 50mOhm @ 1kHz | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 1.400" Dia (35.56mm) | 0.313" (7.95mm) | 0.400" (10.16mm) | - | - | Hybrid Wet Tantalum | - | - | - |
|
THQ1025183Wet Tantalum |
5,228 |
|
- |
THQ | Box | Active | 18000 µF | ±20% | 25 V | Hermetically Sealed | 50mOhm @ 1kHz | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 1.400" Dia (35.56mm) | 0.313" (7.95mm) | 0.400" (10.16mm) | - | - | Hybrid Wet Tantalum | - | - | - |
|
HC2B025102Wet Tantalum |
9,300 |
|
- |
HyCap | Tray | Active | 1000 µF | ±20% | 25 V | Hermetically Sealed | 800mOhm | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 0.281" Dia x 0.641" L (7.14mm x 16.28mm) | - | - | B | - | Hybrid Wet Tantalum | - | - | - |
|
THQ1110152Wet Tantalum |
4,817 |
|
- |
THQ | Box | Active | 1500 µF | ±20% | 110 V | Hermetically Sealed | 200mOhm @ 1kHz | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 1.400" Dia (35.56mm) | 0.313" (7.95mm) | 0.400" (10.16mm) | - | - | Hybrid Wet Tantalum | - | - | - |
|
HC2D150151Wet Tantalum |
2,183 |
|
- |
HyCap | Tray | Active | 150 µF | ±20% | 150 V | Hermetically Sealed | 1.8Ohm | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 0.375" Dia x 1.062" L (9.52mm x 26.97mm) | - | - | D | - | Hybrid Wet Tantalum | - | - | - |
|
HCD060561Wet Tantalum |
2,466 |
|
- |
HyCap | Tray | Active | 560 µF | ±20% | 60 V | Hermetically Sealed | 800mOhm | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 0.375" Dia x 1.062" L (9.52mm x 26.97mm) | - | - | D | - | Hybrid Wet Tantalum | - | - | - |
|
HCB125470Wet Tantalum |
3,783 |
|
- |
HyCap | Tray | Active | 47 µF | ±20% | 125 V | Hermetically Sealed | 2.3Ohm | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 0.281" Dia x 0.641" L (7.14mm x 16.28mm) | - | - | B | - | Hybrid Wet Tantalum | - | - | - |
|
TDD1080302Wet Tantalum |
9,515 |
|
- |
TDD | Box | Active | 3000 µF | ±20% | 80 V | Hermetically Sealed | 55mOhm @ 1kHz | -55°C ~ 85°C | - | Through Hole | 1.400" L x 1.400" W (35.56mm x 35.56mm) | 0.327" (8.31mm) | 0.400" (10.16mm) | - | - | Hybrid Wet Tantalum | - | - | - |
|
TDD1025243Wet Tantalum |
2,227 |
|
- |
TDD | Box | Active | 24000 µF | ±20% | 25 V | Hermetically Sealed | 30mOhm @ 1kHz | -55°C ~ 85°C | - | Through Hole | 1.400" L x 1.400" W (35.56mm x 35.56mm) | 0.327" (8.31mm) | 0.400" (10.16mm) | - | - | Hybrid Wet Tantalum | - | - | - |
|
THQ1080282Wet Tantalum |
4,593 |
|
- |
THQ | Box | Active | 2800 µF | ±20% | 80 V | Hermetically Sealed | 100mOhm @ 1kHz | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 1.400" Dia (35.56mm) | 0.313" (7.95mm) | 0.400" (10.16mm) | - | - | Hybrid Wet Tantalum | - | - | - |
|
HCD125151Wet Tantalum |
6,281 |
|
- |
HyCap | Tray | Active | 150 µF | ±20% | 125 V | Hermetically Sealed | 1.6Ohm | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 0.375" Dia x 1.062" L (9.52mm x 26.97mm) | - | - | D | - | Hybrid Wet Tantalum | - | - | - |
|
THQ3063123Wet Tantalum |
7,629 |
|
- |
THQ | Box | Active | 0.012 µF | ±20% | 63 V | Hermetically Sealed | 35mOhm @ 1kHz | -55°C ~ 85°C | 2000 Hrs @ 85°C | Through Hole | 1.400" Dia (35.56mm) | 0.608" (15.44mm) | 0.400" (10.16mm) | - | - | Hybrid Wet Tantalum | - | - | - |
|
TDD1010603Wet Tantalum |
9,300 |
|
- |
TDD | Box | Active | 60000 µF | ±20% | 10 V | Hermetically Sealed | 30mOhm @ 1kHz | -55°C ~ 85°C | - | Through Hole | 1.400" L x 1.400" W (35.56mm x 35.56mm) | 0.327" (8.31mm) | 0.400" (10.16mm) | - | - | Hybrid Wet Tantalum | - | - | - |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Tantalum Capacitors components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.