- Part Number
- A2F500M3G-1FG256I
- Manufacturer
- Microchip Technology
- Category
- System On Chip (SoC)
- Package
- 256-LBGA
- Datasheet
- A2F500M3G-1FG256I.pdf
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A2F500M3G-1FG256I Procurement & Engineering Review
This review is prepared to help engineers, buyers and sourcing teams evaluate A2F500M3G-1FG256I from procurement risk, quality verification, BOM support and production-use perspectives.
FPGAX Sourcing Experience
FPGAX provides electronic component sourcing support for global customers. Our support covers early-stage research and development, prototype builds, NPI preparation, mass production purchasing and long-term component supply planning.
- Global
- Electronic component sourcing support
- Quality
- Channel review and quality verification support
- BOM
- Multi-line sourcing and purchasing support
Quality Review Before Quotation
For parts such as A2F500M3G-1FG256I, procurement should not be based only on price or stock. FPGAX focuses on supplier background, channel source, product condition, packaging status, date code, label information and document availability before quotation confirmation.
Review supplier reliability, transaction history and channel stability.
Check label, batch, date code and available supporting documents.
Confirm packing status, moisture-sensitive handling and storage condition when applicable.
Inspect marking, surface condition, lead condition and consistency before shipment.
Engineering Verification Notes
Before using A2F500M3G-1FG256I in a new design or maintenance project, engineers should verify the official manufacturer datasheet and compare operating conditions with actual circuit requirements.
- Confirm supply voltage range, input/output range and circuit operating environment.
- Review bandwidth, gain, noise and stability requirements against the application circuit.
- Check package footprint, soldering process and PCB layout requirements before production.
- Verify whether the selected batch, package suffix and order code match the required design.
- For replacement use, confirm electrical compatibility instead of relying only on similar part numbers.
BOM Sourcing Support
FPGAX supports BOM services backed by component supply. For projects involving multiple ICs, passive components, connectors, modules or production materials, our team can help review shortages, supplier availability, lead time and alternative sourcing options.
- 1
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BOM Review
Check part numbers, brands, package requirements and quantities.
- 2
-
Availability Check
Review stock, lead time, channel source and sourcing feasibility.
- 3
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Risk Feedback
Highlight hard-to-find, obsolete, long-lead-time or high-risk parts.
- 4
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Quotation Support
Provide procurement options based on quantity, delivery and quality requirements.
Procurement Risk Points
Semiconductor procurement may involve stock fluctuation, price changes, package suffix differences, lifecycle changes and market availability risk. For A2F500M3G-1FG256I, the final purchase decision should be based on confirmed quotation, available batch information and engineering approval.
Do not approve a replacement part only by similar function or similar model name. Pinout, package, electrical parameters, temperature range and application conditions must be checked before purchasing or production use.
Supply Chain Review Method
FPGAX supports customers through a managed electronic component supply network. Our internal review focuses on channel reliability, quality control, sales management and order execution management.
| Channel Review | Supplier background, sourcing route, stock stability and delivery feasibility. |
|---|---|
| Quality Control | Label, package, appearance, batch consistency and document review where available. |
| Order Management | Quotation confirmation, quantity confirmation, shipment plan and after-sales tracking. |
| Project Support | R&D, prototype, NPI, production preparation and mass production purchasing support. |
PCB, SMT and PCBA Solution Support
In addition to electronic component supply, FPGAX can support customers with PCB, SMT and PCBA solutions. This helps customers connect component procurement with board-level manufacturing needs and accelerate project delivery.
Component Supply
Support semiconductor and electronic component procurement for project demand.
PCB Support
Assist with board-related project requirements and production coordination.
SMT Support
Connect component preparation with assembly process requirements.
PCBA Support
Support integrated procurement and assembly delivery for project acceleration.
Recommended Purchase Decision Flow
For engineering and purchasing teams, the recommended process is to confirm technical fit first, then confirm supply source, price, lead time and quality requirements before final order approval.
Review Notice
This content is provided for procurement reference, sourcing evaluation and engineering review support. Product parameters, electrical characteristics, lifecycle status and final application suitability must be verified using official manufacturer documentation and project-specific engineering requirements.
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- SmartFusion®
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Architecture:
- MCU, FPGA
- Core Processor:
- ARM® Cortex®-M3
- Flash Size:
- 512KB
- RAM Size:
- 64KB
- Peripherals:
- DMA, POR, WDT
- Connectivity:
- EBI/EMI, Ethernet, I2C, SPI, UART/USART
- Speed:
- 100MHz
- Primary Attributes:
- ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FPBGA (17x17)
1. How to order A2F500M3G-1FG256I on FPGAX?
Currently, FPGAX only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.
2. How does FPGAX guarantee that A2F500M3G-1FG256I is from the original manufacturer or authorized agents?
We have a professional and experienced quality control team to strictly verify and test the A2F500M3G-1FG256I. All suppliers must pass our qualification reviews before they can publish their products including A2F500M3G-1FG256I on FPGAX; we pay more attention to the channels and quality of A2F500M3G-1FG256I products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.
3. Are the A2F500M3G-1FG256I price and inventory displayed accurate?
The price and inventory of A2F500M3G-1FG256I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.
4. What forms of payment are accepted?
Wire Transfer, PayPal, Alipay, Wechat, Credit Card, Western Union, MoneyGram, and Escrow are all acceptable.
Warm Tips: Some orders in certain payment forms may require handling fee.
5. How is the shipping arranged?
Customers can choose industry-leading freight companies, including DHL, UPS, FedEx, TNT, and Registered Mail. Shipping insurance is also available.
Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.
Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.
6. What is the process for return or replacement of A2F500M3G-1FG256I?
All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the A2F500M3G-1FG256I we delivered, we will accept the replacement or return of the A2F500M3G-1FG256I only when all of the below conditions are fulfilled:
(1) Such as a deficiency in quantity, delivery of wrong items, and apparent external defects such as breakage and rust, and we acknowledge such problems.
(2) We are informed of the defect described above within 90 days after the delivery of A2F500M3G-1FG256I.
(3) The PartNo is unused and only in the original unpacked packaging.
Two processes to return the products:
(1) Inform us within 90 days.
(2) Obtain Requesting Return Authorizations.
7. How to contact us to get technical supports, such as A2F500M3G-1FG256I pin diagram, A2F500M3G-1FG256I datasheet?
If you need any after-sales service, please do not hesitate to contact us.
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| Part Number | A2F500M3G-1FGG484 | A2F500M3G-FGG484I | A2F500M3G-FGG484 | A2F500M3G-CS288 | A2F500M3G-FG256 |
| Manufacturer | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Series | SmartFusion® | SmartFusion® | SmartFusion® | SmartFusion® | SmartFusion® |
| Package/Case | 484-BGA | 484-BGA | 484-BGA | 288-TFBGA, CSPBGA | 256-LBGA |
| Packaging | Tray | Tray | Tray | Tray | Tray |
| Product Status | Active | Active | Active | Active | Active |
| Architecture | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA | MCU, FPGA |
| Core Processor | ARM® Cortex®-M3 | ARM® Cortex®-M3 | ARM® Cortex®-M3 | ARM® Cortex®-M3 | ARM® Cortex®-M3 |
| Flash Size | 512KB | 512KB | 512KB | 512KB | 512KB |
| RAM Size | 64KB | 64KB | 64KB | 64KB | 64KB |
| Peripherals | DMA, POR, WDT | DMA, POR, WDT | DMA, POR, WDT | DMA, POR, WDT | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART | EBI/EMI, Ethernet, I2C, SPI, UART/USART | EBI/EMI, Ethernet, I2C, SPI, UART/USART | EBI/EMI, Ethernet, I2C, SPI, UART/USART | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
| Speed | 100MHz | 80MHz | 80MHz | 80MHz | 80MHz |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
| Grade | - | - | - | - | - |
| Qualification | - | - | - | - | - |
| Supplier Device Package | 484-FPBGA (23x23) | 484-FPBGA (23x23) | 484-FPBGA (23x23) | 288-CSP (11x11) | 256-FPBGA (17x17) |
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