| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
TE0726-03-07S-1CIC MOD CORTEX-A9 766MHZ 512MB |
1,625 |
|
Datasheet |
TE0726 | Bulk | Obsolete | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7007S) | 766MHz | 16MB | 512MB | CSI, DSI | 1.570" L x 1.180" W (40.00mm x 30.00mm) | 0°C ~ 70°C |
|
CENPXA270-HLR01-0708R-ACARD ENGINE 64MB SDRAM |
4,917 |
|
- |
* | Box | Obsolete | - | - | - | - | - | - | - | - | - |
|
3352-HX-XX7-RCIC MODULE CORTEX-A8 800MHZ 256MB |
2,709 |
|
Datasheet |
MitySOM | Bulk | Active | MPU Core | ARM® Cortex®-A8, AM3352 | NEON™ SIMD | 800MHz | - | 256MB | SO-DIMM-204 | 2.660" L x 1.500" W (67.60mm x 38.10mm) | 0°C ~ 70°C |
|
|
3359-GX-226-RLIC MOD CORTEX-A8 720MHZ 64KB |
1,797 |
|
Datasheet |
MitySOM | Bulk | Obsolete | MPU Core | ARM® Cortex®-A8, AM3359 | NEON™ SIMD | 720MHz | 256MB (NAND), 8MB (NOR) | 64KB (Internal), 256MB (External) | SO-DIMM-204 | 2.660" L x 1.500" W (67.60mm x 38.10mm) | -40°C ~ 70°C |
|
L138-FX-236-RCIC MOD ARM926EJ-S 456MHZ 8KB |
3,857 |
|
Datasheet |
MityDSP-L138F | Bulk | Obsolete | MPU, DSP, FPGA Core | ARM926EJ-S, OMAP-L138 | TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) | 456MHz | 512MB (NAND), 8MB (NOR) | 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External) | SO-DIMM-200 | 2.660" L x 2.000" W (67.60mm x 50.80mm) | 0°C ~ 70°C |
|
XP3002000-01RIC MOD DSTNI-EX 120MHZ 1.25MB |
4,895 |
|
Datasheet |
XPort® AR™ | Tray | Obsolete | MPU Core | DSTni-EX | XPort AR | 120MHz | 4MB | 1.25MB | RJ45 | 0.650" L x 1.800" W (16.50mm x 45.70mm) | -40°C ~ 85°C |
|
CC-MX-PF47-AEIC MOD ARM926EJ-S 454MHZ 128MB |
3,903 |
|
- |
ConnectCard™ | Bulk | Obsolete | MPU Core | ARM926EJ-S i.mx287 | - | 454MHz | 128MB | 128MB | Edge Connector - 52 | 2.000" L x 1.380" W (51.00mm x 35.00mm) | -40°C ~ 85°C |
|
DC-ME4-01T-CC-1IC MODULE ARM7TDMI 55MHZ 8MB |
3,832 |
|
- |
Digi Connect ME® | Bulk | Obsolete | MPU Core | ARM7TDMI, NS7520 | - | 55MHz | 4MB | 8MB | RJ45 | 1.450" L x 0.750" W (36.70mm x 19.10mm) | -40°C ~ 85°C |
|
SOMDM3730-11-2783IFCR-ASYSTEM ON MODULE LV DM3730 |
2,450 |
|
Datasheet |
DM37x | Bulk | Active | MPU, DSP Core | ARM® Cortex®-A8, DM3730 | TMS320C64x (DSP) | 1GHz | 512MB | 256MB | Board-to-Board (BTB) Socket - 200 | 1.230" L x 3.010" W (31.20mm x 76.50mm) | 0°C ~ 70°C |
|
|
SOMDM3730-11-1783IFXRIC MOD DM3730 800MHZ 256MB |
3,757 |
|
Datasheet |
DM37x | Bulk | Obsolete | MPU Core | DM3730 | - | 800MHz | 512MB (NAND), 16MB (NOR) | 256MB | - | 3.000" L x 1.220" W (76.20mm x 31.00mm) | -20°C ~ 70°C |
|
SOMDM3730-11-2783IFCRIC MOD DM3730 1GHZ 256MB |
2,435 |
|
Datasheet |
DM37x | Bulk | Obsolete | MPU Core | DM3730 | - | 1GHz | 512MB (NAND), 16MB (NOR) | 256MB | - | 3.000" L x 1.220" W (76.20mm x 31.00mm) | 0°C ~ 70°C |
|
TE0808-04-09EG-2IEIC MODULE ZYNQ USCALE 4GB 128MB |
3,903 |
|
Datasheet |
TE0808 | Box | Obsolete | MPU Core | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0745-02-30-1IAIC MODULE CORTEX-A9 1GB 32MB |
3,209 |
|
Datasheet |
TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7030) | - | 32MB | 1GB | Samtec UFPS | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0745-02-35-1CAIC MODULE CORTEX-A9 1GB 32MB |
3,339 |
|
Datasheet |
TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7035) | - | 32MB | 1GB | Samtec UFPS | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 70°C |
|
TE0745-02-45-2IAIC MODULE CORTEX-A9 1GB 32MB |
2,066 |
|
Datasheet |
TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7045) | - | 32MB | 1GB | Samtec UFPS | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0745-02-30-2IAIC MODULE CORTEX-A9 1GB 64MB |
3,314 |
|
Datasheet |
TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7030) | - | 64MB | 1GB | - | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
|
TE0745-02-30-2IIC MODULE CORTEX-A9 1GB 64MB |
1,373 |
|
Datasheet |
TE0745 | Bulk | Obsolete | MCU, FPGA | ARM® Cortex®-A9 | Zynq-7000 (Z-7030) | - | 64MB | 1GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0808-04-09EG-1EEIC MODULE ZYNQ USCALE 4GB 128MB |
3,924 |
|
Datasheet |
TE0808 | Bulk | Obsolete | MPU Core | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
|
TE0808-04-15EG-1EEIC MODULE ZYNQ USCALE 2GB 128MB |
2,502 |
|
Datasheet |
TE0808 | Bulk | Obsolete | MPU Core | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | - | 128MB | 2GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
|
TE0820-02-02CG-1EAIC MODULE ZYNQ USCALE 1GB 128MB |
3,740 |
|
Datasheet |
TE0820 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | - | 128MB | 1GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Microcontrollers, Microprocessor, FPGA Modules components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.