| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
FORLINX-FETMX8MM-C+182GSE8GCA10NXP i.MX8M MiniSOM,2G DDR4,8GB e |
1,596 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM Cortex-A53, ARM® Cortex®-M4F | - | 1.8GHz | 8GB eMMC | 2GB | Board-to-Board (BTB) Socket - 240 | 2.200" L x 1.417" W (56.00mm x 36.00mm) | 0°C ~ 70°C |
|
FORLINX-FET7110-C+154GSE32GCF11StarFive JH7110, SOM, 4GB LPDDR4 |
4,870 |
|
Datasheet |
StarFive JH7110 | Tape & Box (TB) | Active | MPU | JH7110 Quad +RISC-V | - | 1.5GHz | 32GB eMMC | 4GB | Board-to-Board (BTB) 3 x 80 Pin | 2.360" L x 1.496" W (60.00mm x 38.00mm) | 0°C ~ 80°C |
|
FORLINX-FET-G2LD-C+122GOE16M16GIB11Renesas RZ/G2L (R9A07G044Lxx)SOM |
2,565 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55, ARM® Cortex®-M33 | - | 1.2GHz | 16GB eMMC,16MB (NOR) | 2GB | Board-to-Board (BTB) Socket - 240 | 1.496" L x 2.360" W (38.00mm x 60.00mm) | -40°C ~ 85°C |
|
FORLINX-FET527N-C+182GSE16GIA11Allwinner T527N, SOM, 2GB LPDDR4 |
1,216 |
|
Datasheet |
Allwinner T527N | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 8-Core | - | 1.8GHz | 16GB eMMC | 2GB | Board-to-Board (BTB) Socket - 4 x 80 | 2.756" L x 1.811" W (70.00mm x 46.00mm) | -40°C ~ 85°C |
|
FORLINX-FET3568J-C+182GSE16GIB10Rockchip RK3568SOM, 2GB DDR4, 16 |
1,382 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 | - | 1.8GHz | 16GB eMMC | 2GB | Board-to-Board (BTB) 4 x 80 Pin | 1.770" L x 2.756" W (45.00mm x 70.00mm) | -40°C ~ 85°C |
|
FORLINX-FET3576-C+232GSE32GCA11Rockchip 35676, SOM, 2GB LPDDDR4 |
2,266 |
|
Datasheet |
RK3576 | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 Quad, ARM® Cortex®-A72 | - | 2.3GHz | 32GB eMMC | 2GB | Board-to-Board (BTB) Socket - 4 x 100 | 2.677" L x 1.969" W (68.00mm x 50.00mm) | 0°C ~ 80°C |
|
FORLINX-FET3576-C+234GSE32GCA11Rockchip 35676, SOM, 4GB LPDDDR4 |
2,182 |
|
Datasheet |
RK3576 | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 Quad, ARM® Cortex®-A72 | - | 2.3GHz | 32GB eMMC | 4GB | Board-to-Board (BTB) Socket - 4 x 100 | 2.677" L x 1.969" W (68.00mm x 50.00mm) | 0°C ~ 80°C |
|
FORLINX-FET-D9360-C+204GSE32GIB11SemiDrive D9 Pro, SOM, 4GB LPDDR |
3,113 |
|
Datasheet |
SemiDrive D9 Pro | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 6-Core | - | 2.0GHz | 32GB eMMC | 4GB | Board-to-Board (BTB) 4 x 100 Pin | 2.559" L x 1.732" W (65.00mm x 44.00mm) | -40°C ~ 85°C |
|
FORLINX-FET527N-C+184GSE32GIB11Allwinner T527N, SOM, 4GB LPDDR4 |
4,020 |
|
Datasheet |
Allwinner T527N | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 8-Core | - | 1.8GHz | 32GB eMMC | 4GB | Board-to-Board (BTB) Socket - 4 x 80 | 2.756" L x 1.811" W (70.00mm x 46.00mm) | -40°C ~ 85°C |
|
FORLINX-FETMX8MPQ-C+164GOE16(16G)IA10NXP i.MX8M PlusSOM,4G LPDDR4, 16 |
1,761 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53, ARM® Cortex®-M7 | - | 1.6GHz | 16GB eMMC, 16MB (NOR) | 4GB | Board-to-Board (BTB) 4 x 80 Pin | 2.441" L x 0.118" W (62.00mm x 32.00mm) | -40°C ~ 85°C |
|
FORLINX-FET1028A-C+152GOE16M8GIA12NXP LS1028ASOM,2GB DDR4,8GB eMMC |
3,748 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A72 | - | 1.5GHz | 8GB eMMC, 16Mb QSPI | 2GB | Board-to-Board (BTB) Socket - 160 | 1.653" L x 2.559" W (42.00mm x 65.00mm) | -40°C ~ 85°C |
|
FORLINX-OK7110-C+152GSE32GCE11C11ARM DEVELOPMENT BOARD,StarFive |
4,455 |
|
Datasheet |
StarFive JH7110 | Tape & Box (TB) | Active | MPU | JH7110 Quad +RISC-V | - | 1.5GHz | 32GB eMMC | 2GB | Board-to-Board (BTB) 3 x 80 Pin | 7.480" L x 5.118" W (190.00mm x 130.00mm) | 0°C ~ 80°C |
|
FORLINX-FET3588-C+244GSE32GCC11Rockchip RK3588 SOM,4GBLPDDR4x,3 |
2,032 |
|
Datasheet |
RK3588 | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55, ARM® Cortex®-A76 | - | 2.4GHz | 32GB eMMC | 4GB | 4 x 100 Pin | 1.970" L x 2.677" W (50.00mm x 68.00mm) | 0°C ~ 70°C |
|
FORLINX-FET3588-C+248GSE64GCD11Rockchip RK3588 SOM,8GBLPDDR4x,6 |
3,797 |
|
Datasheet |
RK3588 | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55, ARM® Cortex®-A76 | - | 2.4GHz | 64GB eMMC | 8GB | 4 x 100 Pin | 1.970" L x 2.677" W (50.00mm x 68.00mm) | 0°C ~ 70°C |
|
FORLINX-FET3588J-C+224GSE32GIA11Rockchip RK3588J SOM,4GBLPDDR4x, |
3,887 |
|
- |
- | Tape & Box (TB) | Active | - | - | - | - | - | - | - | - | - |
|
FORLINX-FET1046A-C+182GQE01IA13NXP LS1046ASOM,2GB DDR4,8GB eMMC |
3,046 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A72 | - | 1.8GHz | 8GB eMMC, 16Mb QSPI | 2GB | Board-to-Board (BTB) 2 x 110 Pin | 3.307" L x 2.165" W (84.00mm x 55.00mm) | -40°C ~ 75°C |
|
B13500-DIM-001-0001Highly compact DIMMBoard with ex |
2,563 |
|
Datasheet |
DIMM-PC® | Retail Package | Active | MPU Core | Vortex86DX | - | 1GHz | - | 256MB | USB | 3.386" L x 1.575" W (86.00mm x 40.00mm) | 0°C ~ 60°C |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Microcontrollers, Microprocessor, FPGA Modules components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.