| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Module/Board Type | Core Processor | Co-Processor | Speed | Flash Size | RAM Size | Connector Type | Size / Dimension | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0808-05-9BE81-EKULTRASOM+ MPSOC MODULE WITH ZYNQ |
4,114 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0808-05-BBE81-EULTRASOM+ MPSOC MODULE WITH ZYNQ |
2,581 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0808-05-6BE81-FULTRASOM+ MPSOC MODULE WITH ZYNQ |
3,562 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0808-05-6BE81-EKULTRASOM+ MPSOC MODULE WITH ZYNQ |
1,070 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0808-05-BBE81-EKULTRASOM+ MPSOC MODULE WITH ZYNQ |
1,664 |
|
- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
G650-04474-01CORAL 4GB SOM |
4,111 |
|
- |
- | Bulk | Active | MPU Core | ARM® Cortex®-A53 | - | 1.5GHz | 8GB eMMC | 1GB | - | - | -20°C ~ 85°C |
|
FORLINX-FET113i-S+12256SN256IA10Allwinner T113-I,SOM, 256MB DDR3 |
1,448 |
|
Datasheet |
Allwinner T113i-S | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A7, Dual-Core | - | 1.2GHz | 256MB | 256MB | Edge Connector | 1.732" L x 1.378" W (44.00mm x 35.00mm) | -40°C ~ 85°C |
|
FORLINX-FETMX6ULL-S+08256SN256IA12NXP i.MX6ULLSOM, 256MB DDR3,256M |
2,059 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A7 | - | 80MHz | 256MB (NAND) | 256MB | Edge Connector | 1.380" L x 1.732" W (35.00mm x 44.00mm) | -40°C ~ 85°C |
|
FORLINX-FET113i-S+12512SE8GIB10Allwinner T113-I,SOM, 512MB DDR3 |
4,951 |
|
Datasheet |
Allwinner T113i-S | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A7, Dual-Core | - | 1.2GHz | 8GB eMMC | 512MB | Edge Connector | 1.732" L x 1.378" W (44.00mm x 35.00mm) | -40°C ~ 85°C |
|
FORLINX-FETMX6ULL-S+08512SE8GED13NXP i.MX6ULLSOM,512MB DDR3,8GB e |
1,578 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A7 | - | 800MHz | 8GB eMMC | 512MB | Edge Connector | 1.380" L x 1.732" W (35.00mm x 44.00mm) | -25°C ~ 85°C |
|
FORLINX-FETMX6ULL-C+08512SE8GIA11NXP i.MX6ULLSOM,512MB DDR3,8GB e |
4,038 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A7 | - | 800MHz | 8GB eMMC | 512MB | Board-to-Board (BTB) Socket - 160 | 1.570" L x 1.142" W (40.00mm x 29.00mm) | -40°C ~ 85°C |
|
FORLINX-FETA40i-C+121GSE8GEA12Allwinner A40iSOM,1GB DDR3,8GB e |
2,457 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A7 | - | 1.2GHz | 8GB eMMC | 1GB | Board-to-Board (BTB) 4 x 80 Pin | 2.700" L x 1.772" W (68.00mm x 45.00mm) | -25°C ~ 85°C |
|
FORLINX-FET3562J-C+181GSE8GIA10Rockchip 3562J, SOM, 1GB LPDDDR4 |
3,169 |
|
Datasheet |
RK3562J | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 Quad | - | 1.8GHz | 8GB eMMC | 1GB | Board-to-Board (BTB) Socket - 3 x 80 | 2.205" L x 1.417" W (56.00mm x 36.00mm) | -40°C ~ 85°C |
|
FORLINX-FET3562J-C+182GSE16GIB10Rockchip 3562J, SOM, 2GB LPDDDR4 |
3,477 |
|
Datasheet |
RK3562J | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 Quad | - | 1.8GHz | 16GB eMMC | 2GB | Board-to-Board (BTB) Socket - 3 x 80 | 2.205" L x 1.417" W (56.00mm x 36.00mm) | -40°C ~ 85°C |
|
FORLINX-FETA40i-C+121GSE8GIB12Allwinner A40iSOM,1GB DDR3,8GB e |
2,880 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A7 | - | 1.2GHz | 8GB eMMC | 1GB | Board-to-Board (BTB) 4 x 80 Pin | 2.700" L x 1.772" W (68.00mm x 45.00mm) | -40°C ~ 85°C |
|
FORLINX-FETMX9352-C+151GSE8GIB11NXP i.MX9352SOM,1GB LPDDR4, 8GB |
2,968 |
|
Datasheet |
- | Tape & Box (TB) | Active | - | - | - | - | - | - | - | - | - |
|
FORLINX-FET3568-C+202GSE16GCA10Rockchip RK3568SOM, 2GB DDR4, 16 |
1,199 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A55 | - | 2.0GHz | 16GB eMMC | 2GB | Board-to-Board (BTB) | 1.770" L x 2.756" W (45.00mm x 70.00mm) | 0°C ~ 80°C |
|
FORLINX-FETT507-C+152GSE8GIA10Allwinner T507SOM, 2GB DDR3L, 8G |
4,092 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 | - | 1.5GHz | 8GB eMMC | 2GB | Board-to-Board (BTB) Socket - 240 | 2.760" L x 1.570" W (70.00mm x 40.00mm) | -40°C ~ 85°C |
|
FORLINX-FET1012A-C+10512MOE01IA11NXP LS1012ASOM,512MB DDR3L 8GB e |
3,862 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53 | - | 1.0GHz | 8GB eMMC, 16Mb QSPI | 512MB | Board-to-Board (BTB) Socket - 160 | 1.770" L x 1.570" W (45.00mm x 40.00mm) | -40°C ~ 80°C |
|
FORLINX-FET6254-C+142GSE8GIB11TI AM6254SOM,2GB DDR4, 8GB eMMC |
2,036 |
|
Datasheet |
- | Tape & Box (TB) | Active | MPU | ARM® Cortex®-A53, ARM® Cortex®-M4F | - | 1.4GHz | 8GB eMMC | 2GB | Board-to-Board (BTB) 4 x 80 Pin | 1.496" L x 2.360" W (38.00mm x 60.00mm) | -40°C ~ 85°C |
FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Microcontrollers, Microprocessor, FPGA Modules components, we support both current production requirements and long-term component availability across demanding product lifecycles.
Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.
| Requirement | FPGAX Support |
| Current production | Active FPGA, programmable logic, and semiconductor component sourcing |
| Legacy programs | End-of-life and hard-to-find component sourcing |
| Supply continuity | Lifecycle transition and long-term availability support |
| Quality requirements | Traceable sourcing and quality-management processes |
FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.
Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.
Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.
We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.
FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.
Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.