Microcontrollers, Microprocessor, FPGA Modules

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Module/Board Type Core Processor Co-Processor Speed Flash Size RAM Size Connector Type Size / Dimension Operating Temperature
TE0600-04-52I11-M Trenz Electronic GmbH

TE0600-04-52I11-M

IC MODULE GIGABEE

Trenz Electronic GmbH

1,556
RFQ

-

- Bulk Active FPGA Xilinx Spartan™ 6 XC6SLX45-2FGG484I - 100MHz 16MB 128MB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0725-04-72I-1-B Trenz Electronic GmbH

TE0725-04-72I-1-B

IC MOD ARTIX-7 A100T 100MHZ 32MB

Trenz Electronic GmbH

2,574
RFQ

-

- Bulk Active - - - - - - - - -
TE0720-04-61C33MA Trenz Electronic GmbH

TE0720-04-61C33MA

SOC MODULE WITH XILINX ZYNQ 7020

Trenz Electronic GmbH

1,562
RFQ

-

TE0722 Bulk Active MPU Core Zynq™ XC7Z020-1CLG484C ARM Cortex-A9 - 32MB 8GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
TE0630-03-63I12-A Trenz Electronic GmbH

TE0630-03-63I12-A

FPGA MODULE WITH AMD SPARTAN 6 L

Trenz Electronic GmbH

2,003
RFQ

-

Spartan Bulk Active FPGA Xilinx Spartan™ 6 XC6SLX75-3CSG484I - - 8MB 128MB Board-to-Board (BTB) Socket - 80 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0712-03-71I36-A Trenz Electronic GmbH

TE0712-03-71I36-A

FPGA MODULE ARTIX7

Trenz Electronic GmbH

3,790
RFQ

-

TE0712 Bulk Active FPGA Core Artix-7 XC7A100T-1FGG484I - - 32MB 1GB Board-to-Board (BTB) Socket 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0600-04-72C11-A Trenz Electronic GmbH

TE0600-04-72C11-A

IC MODULE GIGABEE

Trenz Electronic GmbH

4,852
RFQ

-

- Bulk Active FPGA Xilinx Spartan™ 6 XC6SLX100-2FGG484C - 125MHz 16MB 128MB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
TE0803-04-2AE11-A Trenz Electronic GmbH

TE0803-04-2AE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

1,252
RFQ
TE0803-04-2AE11-A Datasheet

Datasheet

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU2CG-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0712-03-82C36-L Trenz Electronic GmbH

TE0712-03-82C36-L

FPGA MODULE ARTIX7

Trenz Electronic GmbH

2,704
RFQ
TE0712-03-82C36-L Datasheet

Datasheet

- Bulk Active FPGA Core Artix-7 XC7A200T-2FBG484C - - 32MB 1GB 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) 0°C ~ 70°C
TE0813-02-2AE81-A Trenz Electronic GmbH

TE0813-02-2AE81-A

MPSOC MODULE WITH AMD ZYNQ ULTRA

Trenz Electronic GmbH

4,386
RFQ

-

Zynq UltraScale+ Bulk Active MPU Core Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 4 x 240 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
TE0820-05-2AI81MA Trenz Electronic GmbH

TE0820-05-2AI81MA

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

4,764
RFQ

-

- Bulk Active MPU Core Zynq UltraScale+ XCZU2CG-1SFVC784I - - 128MB 2GB 2 x 100 Pin 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0713-03-82C46-A Trenz Electronic GmbH

TE0713-03-82C46-A

IC SOM ARTIX-7 FPGA DDR3

Trenz Electronic GmbH

1,457
RFQ

-

- Bulk Active - - - - - - - - -
TE0715-05-71I33-L Trenz Electronic GmbH

TE0715-05-71I33-L

IC SOC MODULE

Trenz Electronic GmbH

3,854
RFQ

-

- Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7030) 125MHz 32MB 1GB Samtec LSHM 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0600-04-83I21-A Trenz Electronic GmbH

TE0600-04-83I21-A

IC MODULE GIGABEE

Trenz Electronic GmbH

2,709
RFQ

-

- Bulk Active FPGA Xilinx Spartan™ 6 XC6SLX150-3FGG484I - 125MHz 16MB 512MB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0600-04-83I11-A Trenz Electronic GmbH

TE0600-04-83I11-A

IC MODULE GIGABEE

Trenz Electronic GmbH

2,252
RFQ

-

- Bulk Active FPGA Xilinx Spartan™ 6 XC6SLX150-3FGG484I - 125MHz 16MB 128MB B2B 1.970" L x 1.570" W (50.00mm x 40.00mm) -40°C ~ 85°C
TE0728-04-1Q Trenz Electronic GmbH

TE0728-04-1Q

IC MODULE CORTEX-A9 512MB

Trenz Electronic GmbH

2,135
RFQ
TE0728-04-1Q Datasheet

Datasheet

TE0728 Bulk Active MCU, FPGA ARM Cortex-A9 Zynq-7000 (Z-7020) - 16MB 512MB Samtec SEM 2.360" L x 2.360" W (60.00mm x 60.00mm) -
TE0803-04-4BE11-A Trenz Electronic GmbH

TE0803-04-4BE11-A

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

2,140
RFQ
TE0803-04-4BE11-A Datasheet

Datasheet

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4EG-1SFVC784E - - 128MB 2GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0745-03-71I31-A Trenz Electronic GmbH

TE0745-03-71I31-A

MOD SOM DDR3L 1GB

Trenz Electronic GmbH

3,174
RFQ

-

Zynq® UltraScale+™ Bulk Active FPGA ARM® Cortex®-A9 Zynq-7000 (Z-7030) - 64MB 1GB Board-to-Board (BTB) Socket 2.047" L x 2.992" W (52.00mm x 76.00mm) -40°C ~ 85°C
TE0813-02-4BE81-A Trenz Electronic GmbH

TE0813-02-4BE81-A

MODULE MPSOC 4GB DDR4

Trenz Electronic GmbH

1,629
RFQ

-

Zynq® UltraScale+™ Box Active FPGA Xilinx Zynq UltraScale+ ZU4EG - - 128MB 2GB BGA 2.047" L x 2.992" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0803-04-4DE21-L Trenz Electronic GmbH

TE0803-04-4DE21-L

IC MODULE ZYNQ USCALE 2GB 128MB

Trenz Electronic GmbH

2,200
RFQ
TE0803-04-4DE21-L Datasheet

Datasheet

TE0803 Bulk Active MPU Core Zynq UltraScale+ XCZU4EV-1SFVC784E - - 128MB 4GB B2B 2.050" L x 2.990" W (52.00mm x 76.00mm) 0°C ~ 85°C
TE0803-04-4GE21-L Trenz Electronic GmbH

TE0803-04-4GE21-L

MPSOC MODULE WITH XILINX ZYNQ UL

Trenz Electronic GmbH

1,114
RFQ

-

TE0803 Bulk Active MPU Core Zynq™ UltraScale+™ XCZU4EG-2SFVC784E - - 128MB 4GB Board-to-Board (BTB) Socket - 160 2.990" L x 2.050" W (76.00mm x 52.00mm) 0°C ~ 85°C
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Microcontrollers, Microprocessor, FPGA Modules Electronic Components Sourcing and Lifecycle Support

FPGAX is a global sourcing partner specializing in FPGA and programmable logic solutions for engineering and manufacturing organizations worldwide. For customers sourcing Microcontrollers, Microprocessor, FPGA Modules components, we support both current production requirements and long-term component availability across demanding product lifecycles.

Our sourcing approach combines traceability, supply stability, and technical coordination. FPGAX is certified to AS9120B, ISO 9001:2008, and ISO 14001 standards and supports procurement programs where continuity, documentation, and dependable component supply are important.

How FPGAX Supports Microcontrollers, Microprocessor, FPGA Modules Requirements

  • Active component sourcing: support for current FPGA, programmable logic, and related semiconductor requirements.
  • End-of-life sourcing: assistance with obsolete and hard-to-find parts when designs must remain in production.
  • Lifecycle management: sourcing support during product transitions, allocation periods, and supply interruptions.
  • Design continuity: long-term supply support intended to reduce redesign pressure and production disruption.
  • Major programmable logic brands: sourcing coverage includes Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic.

Supply Support at a Glance

Requirement FPGAX Support
Current production Active FPGA, programmable logic, and semiconductor component sourcing
Legacy programs End-of-life and hard-to-find component sourcing
Supply continuity Lifecycle transition and long-term availability support
Quality requirements Traceable sourcing and quality-management processes

Focused on FPGA and Programmable Logic Supply

FPGAX focuses on helping customers maintain access to critical programmable devices throughout the full component lifecycle. Whether the requirement is for a current design, an established production program, or an older platform facing component obsolescence, our goal is to provide a stable sourcing path and help customers maintain design and manufacturing continuity.

Microcontrollers, Microprocessor, FPGA Modules FAQ

Can FPGAX source both active and end-of-life Microcontrollers, Microprocessor, FPGA Modules components?

Yes. FPGAX supports sourcing for both active components and end-of-life or hard-to-find parts, with an emphasis on maintaining supply continuity for engineering and manufacturing programs.

Which programmable logic manufacturers does FPGAX support?

Our core sourcing coverage includes major FPGA and programmable logic manufacturers such as Xilinx, Intel/Altera, Lattice, Microchip, and QuickLogic, subject to specific part requirements and availability.

How does FPGAX help with component lifecycle changes?

We support customers through lifecycle transitions by helping locate current or legacy supply, reducing exposure to supply disruptions, and supporting long-term availability for designs that need to remain in production.

What quality and traceability standards does FPGAX follow?

FPGAX states certification to AS9120B, ISO 9001:2008, and ISO 14001 standards. Our sourcing services are structured around traceability, stable supply, and quality-management requirements.

What information should I provide for a Microcontrollers, Microprocessor, FPGA Modules sourcing request?

Providing the manufacturer part number, required quantity, target delivery schedule, and any lifecycle or traceability requirements helps us evaluate the sourcing request more efficiently.