| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC35FS4501CAER2FS4500 NXP USA Inc. |
2,857 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MFS8412AMBP8ESSAFETY POWER MANAGEMENT IC, QFN4 NXP USA Inc. |
1,242 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS8412AMBP7ESSAFETY POWER MANAGEMENT IC, QFN4 NXP USA Inc. |
4,638 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MC35FS6508NAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
2,724 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC35FS6507NAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
4,342 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS8510A2ESR2SYSTEM BASIS CHIP FS8500 NXP USA Inc. |
4,539 | - |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MC33FS8510B6ESR2FS8500 NXP USA Inc. |
4,672 | - |
|
- |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MC33FS8510D3ESR2FS8510 NXP USA Inc. |
4,742 | - |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Power Supplies | - | 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC35FS6501CAER2FS6500 NXP USA Inc. |
4,242 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS6512LAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
2,132 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |