| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF8200DBESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
4,551 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DFESI.MX8QXP WITH DDR3L NXP USA Inc. |
1,666 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DHESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
1,678 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200ESESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
2,394 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200ETESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
1,934 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DMESPOWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
1,489 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200DNESPOWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
4,646 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200EMESPOWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
1,760 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS6600M2KSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
1,864 | - |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS6600M1KSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
3,038 | - |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |