| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MFS2321BMBB2EPR2MFS2321BMBB2EPR2 NXP USA Inc. |
3,150 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 5.5V ~ 40V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS2302BMBA0EPR2MFS2302BMBA0EPR2 NXP USA Inc. |
1,310 | - |
|
Datasheet |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MFS2322BMMA0EPR2MFS2322BMMA0EPR2 NXP USA Inc. |
3,559 | - |
|
Datasheet |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MFS2321BMMA0EPMFS2321BMMA0EP NXP USA Inc. |
3,676 | - |
|
Datasheet |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MFS2302BMMA0EPMFS2302BMMA0EP NXP USA Inc. |
4,870 | - |
|
Datasheet |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MFS2324BMBA0EPMFS2324BMBA0EP NXP USA Inc. |
4,325 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Bulk | Active | System Basis Chip | - | 3.3V, 5V | -40°C ~ 120°C | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MC34PF3001A6EPIC POWER MANAGEMENT 48QFN NXP USA Inc. |
2,378 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MCZ33742SEGIC SYSTEM BASIS CHIP CAN 28-SOIC NXP USA Inc. |
3,677 | - |
|
Datasheet |
- | 28-SOIC (0.295", 7.50mm Width) | Tube | Obsolete | - | 42mA | 5.5V ~ 18V | -40°C ~ 125°C | Automotive | - | Surface Mount | 28-SOIC |
|
MFS2320BMBB1EPMFS2320BMBB1EP NXP USA Inc. |
1,420 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | System Basis Chip | 30µA | 5.5V ~ 40V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS2323BMMA0EPR2MFS2323BMMA0EPR2 NXP USA Inc. |
2,162 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 5.5V ~ 40V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |