| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MPF5020CMMACESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
3,609 | - |
|
Datasheet |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MPF5020AMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
2,050 | - |
|
- |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Microcontroller, MCU | 40µA | 2.7V ~ 5.5V | -40°C ~ 150°C (TJ) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
PCA9452AHNKPCA9452AHNK NXP USA Inc. |
1,445 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Bulk | Active | Processor | - | - | -40°C ~ 105°C (TA) | - | - | Surface Mount | 56-HVQFN-EP (8x8) |
|
MPF5023AVNA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
2,943 | - |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5023CMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
1,741 | - |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5023AMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
2,876 | - |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5023CVNA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
4,157 | - |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MWCT1012VLFR32BIT 64K FLASH 2KB FLEX NXP USA Inc. |
3,160 | - |
|
Datasheet |
- | 48-LQFP | Tape & Reel (TR) | Active | Wireless Power Transmitter | 1.7mA | 3V ~ 3.6V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 48-LQFP (7x7) |
|
MWSP10C1AVLCRAUTOQI WIRELESS CHARGING NXP USA Inc. |
4,047 | - |
|
- |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MFS2302BMBA0EPMFS2302BMBA0EP NXP USA Inc. |
3,865 | - |
|
Datasheet |
- | - | Tray | Active | - | - | - | - | - | - | - | - |