| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MFS2323BMBA1EPMFS2323BMBA1EP NXP USA Inc. |
2,361 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | - | - | - | - | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
|
MFS8630BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
1,367 | - |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
|
MFS8600BMBA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
2,750 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS2600AMBA0ADR2AUTO SBC NXP USA Inc. |
4,650 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | 30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
|
MPF5030BMDA0ESR2POWER MANAGEMENT IC, S32, NON-PR NXP USA Inc. |
4,309 | - |
|
Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MC33FS6510NAER2SYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
2,855 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
|
|
MFS8622BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
3,206 | - |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
|
MPF5032BMBA0ESPMIC 2 BUCKS 2 LDO A1 DIE NXP USA Inc. |
4,548 | - |
|
Datasheet |
- | 40-PowerVFQFN | Tray | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MFS8621BMDA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
3,378 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MC13892AJVKR2IC PMU I.MX51/37/35/27 139MAPBGA NXP USA Inc. |
3,960 | - |
|
- |
- | 139-TFBGA | Tape & Reel (TR) | Obsolete | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | - | - | Surface Mount | 139-PBGA (7x7) |