| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MPF5032BMDA0ESR2PMIC 2 BUCKS 2 LDO NXP USA Inc. |
4,935 | - |
|
Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MC33FS6505KAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
1,059 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MWSP10C1AVLCAUTOQI WIRELESS CHARGING NXP USA Inc. |
1,491 | - |
|
- |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MPF5024CMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
3,281 | - |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5024CVNA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
2,929 | - |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5030BMBA0ESR2PMIC 3 BUCKS 2 LDO A1 DIE NXP USA Inc. |
1,748 | - |
|
Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5200AMMG2ESR2POWER MANAGEMENT SPECIALIZED - P NXP USA Inc. |
1,084 | - |
|
Datasheet |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MPF5200AMMG3ESR2POWER MANAGEMENT SPECIALIZED - P NXP USA Inc. |
1,989 | - |
|
Datasheet |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MC33FS6515NAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
3,007 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC32PF8121EUEPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
1,014 | - |
|
Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Industrial, IoT | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |