| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MFS2323BMBA5EPR2MFS2323BMBA5EPR2 NXP USA Inc. |
4,248 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 30µA | 5.5V ~ 40V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS2323BMBA0EPR2MFS2323BMBA0EPR2 NXP USA Inc. |
4,817 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | - | - | - | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS2323BMBA1EPR2MFS2323BMBA1EPR2 NXP USA Inc. |
2,342 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | - | - | - | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS2323BMMA0EPMFS2323BMMA0EP NXP USA Inc. |
4,259 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | System Basis Chip | - | 5.5V ~ 40V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MFS2303BMBA0EPMFS2303BMBA0EP NXP USA Inc. |
3,582 | - |
|
Datasheet |
- | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MCZ33099CEGR2IC VREG ALTERNATOR ADAPT 16-SOIC NXP USA Inc. |
4,327 | - |
|
Datasheet |
- | 16-SOIC (0.295", 7.50mm Width) | Tape & Reel (TR) | Obsolete | - | 6.5mA | 7V ~ 18V | -40°C ~ 125°C | Automotive | - | Surface Mount | 16-SOIC |
|
MC32PF3001A2EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
1,483 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MC32PF3001A4EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
4,458 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MC32PF3001A5EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
4,840 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MFS2325BMBA0EPMFS2325BMBA0EP NXP USA Inc. |
2,239 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Bulk | Active | System Basis Chip | - | 3.3V, 5V | -40°C ~ 120°C | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |