| Manufacturer | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MPF5024AMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
2,956 | - |
|
- |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5024AVNA0ESR2PF5024 NXP USA Inc. |
1,779 | - |
|
- |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5032BMMA0ESR2PMIC 2 BUCKS 2 LDO A1 DIE NXP USA Inc. |
3,027 | - |
|
Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5032BMMA5ESR2PMIC 2 BUCKS 2 LDO A1 DIE NXP USA Inc. |
4,796 | - |
|
Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5023CVNA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
3,918 | - |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5023CMMA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
4,216 | - |
|
Datasheet |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MC33FS6505NAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
4,807 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS4500NAER2SYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
4,594 | - |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
|
MPF5032BMBA0ESR2PMIC 2 BUCKS 2 LDO A1 DIE NXP USA Inc. |
4,080 | - |
|
Datasheet |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MFS8630BMBA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
1,620 | - |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |